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Control substrate and control substrate manufacturing method

A technology for controlling substrates and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, instruments, electrical components, etc., and can solve problems such as increased manufacturing costs

Inactive Publication Date: 2010-11-10
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In the sputtering method, vapor deposition method, and CVD method, etc., it is necessary to use a vacuum device to form FET5 in a vacuum, so there is a problem that the manufacturing cost increases

Method used

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  • Control substrate and control substrate manufacturing method
  • Control substrate and control substrate manufacturing method
  • Control substrate and control substrate manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0087] As an example, a test substrate in which a substrate main body, a base layer, and a conductor layer were sequentially laminated was produced.

[0088] First, prepare a glass substrate of 200 mm x 200 mm as the substrate main body, then apply a negative photosensitive material mainly composed of acrylic resin on the entire surface of one surface of the substrate main body, and heat at 95° C. for 10 minutes. The pre-baking treatment is performed, and then the coated photosensitive material is exposed, developed with KOH, and then post-baked at 170° C. for 30 minutes to form a base layer.

[0089] Then, a suspension of Ag with a particle diameter of 3 nm to 5 nm dispersed in toluene was applied to one surface of the base layer in the thickness direction Z, and heat treatment was performed by heating at 170° C. for 30 minutes to form a conductor layer.

[0090] In the example, the thickness of the substrate body is 0.7 mm, the thickness of the base layer is 1 μm, and the th...

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Abstract

A control substrate includes: a substrate body; an undercoat layer arranged on one surface in the thickness direction of the substrate body; and a switching element arranged on the surface of the undercoat opposite to the substrate body so as to perform switching between an electric connection and an electric disconnection. The switching element has an electrode formed on the surface of the undercoat layer opposite to the substrate body by the coating method. The undercoat layer is formed by a member having an adhesive feature with the electrode higher than an adhesive feature between an electrode formed on the surface of the substrate body of the undercoat layer side by the coating method and the substrate body.

Description

technical field [0001] The present invention relates to a control substrate for switching between electrical conduction and non-conduction, and a method for manufacturing the control substrate. Background technique [0002] Display devices such as liquid crystal display devices and organic EL display devices include a plurality of light emitting elements, and display predetermined image information by selectively emitting light from each light emitting element. Examples of the driving method for causing the light emitting element to emit light include passive driving and active driving. In an active-driven display device, for example, a field-effect transistor (FET) is arranged between each light-emitting element and a power supply, and each light-emitting element is selected by selectively switching the conduction state and the non-conduction state of each FET. It emits light permanently to display the prescribed image information. In an actively driven display device, a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/786G02F1/1368H01L51/50
CPCH01L27/3262H01L29/78603H01L29/4908H01L29/458H01L27/1214H01L27/1248H01L27/1292H10K59/1213H01L27/1218
Inventor 西冈幸也松室智纪笠原健司
Owner SUMITOMO CHEM CO LTD
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