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Heat dissipation structure with high heat dissipation efficiency and manufacturing method thereof

A technology of a heat dissipation structure and a manufacturing method, which is applied to heat exchange equipment, heat exchanger shells, indirect heat exchangers, etc., can solve the problems of reduced heat dissipation efficiency of heat pipes and high vacuum degree, and achieve good heat dissipation efficiency and improve the effect of vacuum degree.

Inactive Publication Date: 2010-11-17
CATCHER TECH
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  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the manufacturing process of the traditional heat pipe, because a part of the working liquid will be taken away during the vacuuming process, the injection amount of the working liquid in the traditional heat pipe is much less than the expected amount, and in order to avoid excessive If a lot of working fluid is pumped away, the vacuum inside the heat pipe cannot be set too high, which will lead to a decrease in the heat dissipation efficiency of the heat pipe as a whole.

Method used

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  • Heat dissipation structure with high heat dissipation efficiency and manufacturing method thereof
  • Heat dissipation structure with high heat dissipation efficiency and manufacturing method thereof
  • Heat dissipation structure with high heat dissipation efficiency and manufacturing method thereof

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Embodiment Construction

[0033] see figure 1 ,and figure 1 A to figure 1 As shown in E, the first embodiment of the present invention provides a method for manufacturing a heat dissipation structure with high heat dissipation performance, which includes the following steps:

[0034] Step S100 is: first, please refer to figure 1 , Figure 1A1 and Figure 1A2 As shown, a heat dissipation housing 1 is provided, which has a hollow heat dissipation body 10, and the hollow heat dissipation body 10 has at least two ends (10A, 10B). Furthermore, the heat dissipation housing 1 further includes: a plurality of microstructures 11 integrally formed on the inner surface of the hollow heat dissipation body 10, and a plurality of microstructures 11 integrally formed in the hollow heat dissipation body 10 so that the hollow heat dissipation body 10 The inner space is divided into a plurality of supporting boards 12 for accommodating spaces 100 .

[0035] In addition, the heat dissipation housing 1 can be made o...

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Abstract

The invention relates to a manufacturing method of heat dissipation structure with high heat dissipation efficiency, including the following steps: firstly, a heat dissipation shell is provided, the shell is provided with a hollow heat dissipation body, and the hollow heat dissipation body is provided with at least two terminals; one terminal of the hollow heat dissipation body is sealed; operating fluid is injected from the other terminal of the hollow heat dissipation body; then the operating fluid is changed into solid state from liquid state by virtue of external cooling medium; and then the interior of the hollow heat dissipation body is vacuumized; and finally the other terminal of the hollow heat dissipation body is sealed.

Description

technical field [0001] The invention relates to a heat dissipation structure and a manufacturing method thereof, in particular to a heat dissipation structure with high heat dissipation efficiency and a manufacturing method thereof. Background technique [0002] In today's various electronic devices, many electronic components that generate heat during operation are usually used. Especially in the case of increasingly high-speed calculations, these electronic components will inevitably generate more heat than previous electronic components. Taking the central processing unit (CPU) as an example, with the improvement of the processing speed and performance of the central processing unit, the heat output of the current central processing unit increases, and the higher operating frequency also relatively increases the wattage during work. The high temperature generated by it will reduce the service life of the central processing unit, especially when the excessive heat cannot b...

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Application Information

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IPC IPC(8): F28F9/00F28F9/007F28D15/02F28F21/08C23C30/00
Inventor 洪水树李坚玮李士玮
Owner CATCHER TECH