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Acceleration sensor element and acceleration sensor having same

An acceleration sensor and acceleration technology, applied in the direction of measuring acceleration, multi-dimensional acceleration measurement, speed/acceleration/impact measurement, etc., can solve the problems of support substrate or cover contact, greater influence, easy bending and deformation, etc., to reduce the gap, Effect of reducing stress and improving impact strength

Inactive Publication Date: 2012-07-04
TOREX SEMICON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0030] In the acceleration sensor of Patent Document 4, since the inner frame is joined to the support substrate at one point, when the support substrate is bent and deformed, the inner frame is displaced with the joint portion as the base point, and there is a possibility that the inner frame is likely to come into contact with the support substrate or the cover. question
In recent years, customers have strongly requested that the overall thickness of the acceleration sensor be thinned. Therefore, when the support substrate is thinned, it is easy to bend and deform, so the influence of the above-mentioned problems has increased.

Method used

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  • Acceleration sensor element and acceleration sensor having same
  • Acceleration sensor element and acceleration sensor having same
  • Acceleration sensor element and acceleration sensor having same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] figure 1 It is a plan view showing the structure of the acceleration sensor element 10 in the acceleration sensor element 30 with a cover of the first embodiment. figure 2 and image 3 Is a cross-sectional view of the acceleration sensor element 30 with a cover of the first embodiment, figure 2 Yes figure 1 K-k section view of image 3 Yes figure 1 M-m section view.

[0065] The acceleration sensor element 10 with a cover of Embodiment 1, for example, can be applied to the prior art example Figure 16 The acceleration sensor shown is assembled into a resin protective package. Therefore, in the first embodiment, a detailed description will be given focusing on the acceleration sensor element 30 with a cover.

[0066]

[0067] In the acceleration sensor element 10 of the first embodiment, the weight portion 12 is supported in the support frame portion 11 from four directions by the four flexible beam portions 13. The support frame portion 11 is separated by a separation g...

Embodiment 2

[0089] Figure 5 It is a schematic plan view showing the structure of the acceleration sensor element 10 of the second embodiment. In the center of the beam portion 13, a shape in which a ring portion 51 is provided as a compressive stress absorbing portion is formed. The silicon oxide film or the like formed on the surface of the acceleration sensor element 10 has a smaller thermal expansion coefficient than silicon. In addition, during film formation, annealing is performed at a high temperature of, for example, about 950°C. Therefore, heat is generated when cooled to room temperature. stress. The weight portion 12 and the inner frame 15 are formed from the first layer 24 to the second layer 25. Since the thickness of the second layer 25 is thick, it basically shrinks by the thermal expansion coefficient of silicon. However, because the beam portion 13 only consists of the second layer It is composed of one layer 24, so the ratio of silicon oxide film is high, and thermal sh...

Embodiment 3

[0095] Image 6 It is a schematic plan view showing the structure of the acceleration sensor element 10 of the third embodiment. The inner frame support portion 17 is formed in a shape in which a ring portion 52 as a compressive stress absorbing portion is provided. As in the second embodiment, there is an effect of preventing the inner frame support portion 17 from buckling. When the inner frame support portion 17 is buckled, the inner frame 15 is displaced and approaches the upper cover 19 or the lower cover 22, so it is difficult to narrow the gap 31. By forming the ring portion 52 on the inner frame support portion 17, buckling can be prevented. In addition, it has the effect of absorbing the influence of the deformation of the outer frame 16, making it more difficult to change the output.

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PUM

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Abstract

The invention provides an acceleration sensor which does not easily change relative to the external force output and compromises the high sensitivity and impact resistance. A covered acceleration sensor element includes a weight portion, a support frame portion surrounding the weight portion, a plurality of flexible beam portions for connecting the weight portion to the support frame portion to support the weight portion, piezoresistance elements provided on the beam portions, and wirings for connecting them. An upper cover and a lower cover enclosing the periphery of the weight portion together with the support frame portion are joined to the face and back of the support frame portion. Acceleration in the directions of three axes, i.e., a first axis in the joining thickness direction, a second axis in a plane perpendicular to the first axis, and a third axis in the plane and perpendicular to the second axis, or acceleration in the direction of any of the axes, is detected from changes in the resistances of the piezoresistance elements. The support frame portion is separated by separation grooves into an inner frame and an outer frame. The upper cover and the lower cover are joined to the outer frame. The inner frame is connected to the outer frame by a plurality of inner frame support portions having flexibility. The beam portions are connected to both sides of the weight portion along the second axis and the third axis. The inner frame support portions are connected to both sides of the inner frame in a direction in which they are rotated nearly 45 degrees from the second axis and the third axis.

Description

Technical field [0001] The present invention relates to a semiconductor acceleration sensor used for acceleration detection of automobiles, aircraft, portable terminal equipment, toys, etc. Background technique [0002] Acceleration sensors are mostly used in car airbag actuation sensors to detect the impact of car collisions as acceleration. In automobiles, it is sufficient to have a single-axis or dual-axis detection function for measuring the acceleration of the X-axis and Y-axis. In addition, the measured acceleration is very large. Recently, acceleration sensors are increasingly used in portable terminal devices and robots. In order to detect movement in space, a three-axis acceleration sensor that measures the acceleration of the X, Y, and Z axes is required. In addition, in order to detect a small acceleration, a high-resolution, compact acceleration sensor is required. [0003] Most acceleration sensors adopt a structure that converts the motion of the weight portion and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/12G01P15/08G01P15/18H01L29/84
CPCG01P15/0802G01P15/123G01P15/18G01P1/023
Inventor 风间敦斋藤正胜冈田亮二滨口康博
Owner TOREX SEMICON LTD