Vertical heat treatment apparatus

A heat treatment device, vertical technology, applied in the direction of gaseous chemical plating, coating, electrical components, etc., can solve the problem of lack of records, and achieve the effect of improving the use efficiency
CN102437071AActive Publication Date: 2012-05-02TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
TOKYO ELECTRON LTD
Publication Date
2012-05-02

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Abstract

The invention provides a vertical heat treatment apparatus, which comprises a vertical type reaction tube; a shelf-shaped substrate holder used for holding the plurality of substrates and performing the heat treatment on the substrates; a heating part arranged at the periphery of the shelf-shaped substrate holder; a processing gas supply part arranged along the length direction of the reaction tube and provided with gas spray outlets corresponding to height positions of the substrates; exhaust ports arranged on one side of the reaction tube opposite to the gas spray outlets. The substrate holder comprises a plurality of circular holding plates, each circular holding plate is provided with a plurality of substrate loading zones and the holding plates are mutually laminated; a plurality of struts passing through the holding plates and arranged in the circumferential direction of the holding plates.
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Description

technical field

[0001] The present invention relates to a vertical heat treatment apparatus for heat-treating a plurality of substrates mounted on a substrate holder in a shelf shape (Japanese: shed shape) by supplying a processing gas. Background technique

[0002] As a heat treatment apparatus for performing heat treatment such as film formation processing on substrates such as semiconductor wafers (hereinafter referred to as β€œwafer”), a batch-type vertical heat treatment apparatus is known. A plurality of wafers are loaded in a shelf shape, and the wafer boat is airtightly accommodated in a reaction tube, and a film-forming gas is supplied into the reaction tube in a vacuum atmosphere to form a thin film. This wafer boat has: a disc-shaped top plate and a bottom plate; and pillars connecting the top plate and the bottom plate at a plurality of positions over the entire circumferential range from the outer peripheral side. Slit-shaped grooves are formed at a plurality of ...

Claims

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