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Vertical heat treatment apparatus

A heat treatment device, vertical technology, applied in the direction of gaseous chemical plating, coating, electrical components, etc., can solve the problem of lack of records, and achieve the effect of improving the use efficiency

Active Publication Date: 2012-05-02
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Patent Documents 2 and 3 describe techniques for arranging wafers W in the circumferential direction on wafer tray 23b and susceptor 16, and Patent Document 4 describes an apparatus for stacking wafers on top of each other. However, none of the above mentioned subjects

Method used

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  • Vertical heat treatment apparatus
  • Vertical heat treatment apparatus
  • Vertical heat treatment apparatus

Examples

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Embodiment approach

[0034] refer to Figure 1 ~ Figure 3 The vertical heat treatment apparatus of this embodiment is demonstrated. This vertical heat treatment apparatus includes: a wafer boat 11 for loading wafers W in a shelf shape, the wafer boat 11 is made of, for example, quartz and is an example of a substrate holder; and a reaction tube 12 for The wafer boat 11 is accommodated therein to perform a film formation process on each wafer W. The reaction tube 12 is made of, for example, quartz. In this example, the wafer W is made of Si (silicon), has a diameter of, for example, 4 inches (100 mm), and a thickness of, for example, 0.75 mm. A heating furnace main body 14 is provided outside the reaction tube 12, and a heater 13 as an example of a heating portion is provided over the entire circumferential range of the inner wall surface of the heating furnace main body 14. The lower ends of the reaction tube 12 and the heating furnace main body 14 are The entire circumferential range is support...

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Abstract

The invention provides a vertical heat treatment apparatus, which comprises a vertical type reaction tube; a shelf-shaped substrate holder used for holding the plurality of substrates and performing the heat treatment on the substrates; a heating part arranged at the periphery of the shelf-shaped substrate holder; a processing gas supply part arranged along the length direction of the reaction tube and provided with gas spray outlets corresponding to height positions of the substrates; exhaust ports arranged on one side of the reaction tube opposite to the gas spray outlets. The substrate holder comprises a plurality of circular holding plates, each circular holding plate is provided with a plurality of substrate loading zones and the holding plates are mutually laminated; a plurality of struts passing through the holding plates and arranged in the circumferential direction of the holding plates.

Description

technical field [0001] The present invention relates to a vertical heat treatment apparatus for heat-treating a plurality of substrates mounted on a substrate holder in a shelf shape (Japanese: shed shape) by supplying a processing gas. Background technique [0002] As a heat treatment apparatus for performing heat treatment such as film formation processing on substrates such as semiconductor wafers (hereinafter referred to as “wafer”), a batch-type vertical heat treatment apparatus is known. A plurality of wafers are loaded in a shelf shape, and the wafer boat is airtightly accommodated in a reaction tube, and a film-forming gas is supplied into the reaction tube in a vacuum atmosphere to form a thin film. This wafer boat has: a disc-shaped top plate and a bottom plate; and pillars connecting the top plate and the bottom plate at a plurality of positions over the entire circumferential range from the outer peripheral side. Slit-shaped grooves are formed at a plurality of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67C23C16/46
CPCH01L21/02181H01L21/0228H01L21/02178H01L21/67109H01L21/67303
Inventor 两角友一朗佐藤泉
Owner TOKYO ELECTRON LTD