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Contact device for a power semiconductor module

A technology for power semiconductors and contact devices, which is applied to semiconductor devices, semiconductor/solid-state device components, and electric solid-state devices, etc., and can solve problems such as power semiconductor modules stopping operation.

Inactive Publication Date: 2010-12-01
SEMIKRON ELECTRONICS GMBH & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result of this relative movement, in particular after prolonged continuous use or service life of the power semiconductor module, undesired material loss can occur on the contact-conducting end section of the elastic contact element and / or on the connection element of the power semiconductor module, In extreme cases, this material loss can even lead to a shutdown of the power semiconductor modules

Method used

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  • Contact device for a power semiconductor module
  • Contact device for a power semiconductor module
  • Contact device for a power semiconductor module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] figure 1 A chip component 10 with a quadrangular base is shown in perspective. A chip component 10 made of electrically conductive material is arranged on a planar circuit carrier 12 in order to produce a contact connection with a connection element 14 .

[0019] The flat circuit carrier 12 can be, for example, a substrate (DCB) made of aluminum oxide or a printed circuit board (PCB).

[0020] The chip component 10 is designed with a centering recess 16 for a contact-conducting end section 18 of the spring contact element. Respectively figure 2 and 3 Such a contact-conducting end section 18 is illustrated in thin lines. The respective contacting end section 18 can advantageously be formed in a simple straight line in the form of a pin, so that the contacting end section 18 is projected onto the associated connection element of the flat circuit carrier 12 . 14 requires only a small projected area (ie base area), and the associated chip component 10 can also be dime...

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PUM

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Abstract

The invention discloses a contact device for a power semiconductor module, comprising an elastic contact element comprising a contacting-end section (18) that is provided for connection with a connection element (14) of a flat circuit carrier (12) of the power semiconductor module. The contacting-end section (18) is simply linearly formed in the pin shape and the connection element (14) comprises a chip component (10) with a centering recess (16) for the contacting-end section (18) for the elastic contact element. The contact device has simple construction and ensures constant contact feature on the total service life of the power semiconductor module.

Description

technical field [0001] The invention relates to a contacting device for a power semiconductor module, having a resilient contact element with a contacting end section provided for connection to a power semiconductor module Component contact conduction. Background technique [0002] A power semiconductor module is known from DE 10 2005 055 713 A1, which can have elastic contact elements in the form of cylindrical springs. Each cylindrical spring is formed with a linear, pin-shaped contacting end section, which is provided for contacting a connection element of the known power semiconductor module. Pass. A corresponding connection element can be a contact area of ​​a power semiconductor component or a contact area of ​​a conductor track of a substrate of a power semiconductor module. [0003] A contacting device for power semiconductor modules and disk thyristors is known from DE 10 2004 050 588 A1. This known contact device has a resilient contact element, which can be fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L25/07
CPCH05K3/4015H05K2201/0311H05K2201/1025H01L2924/0002H05K2201/09745H05K3/325H01L23/48
Inventor 彼得·莫尔
Owner SEMIKRON ELECTRONICS GMBH & CO KG