Information processing device, information processing method

一种信息处理装置、辅助信息的技术,应用在全面工厂控制、程序控制、仪器等方向,能够解决无法设定制造装置参数、耗费时间、无法共享等问题,达到高效且迅速调节的效果

Inactive Publication Date: 2012-07-18
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, conventionally, there has been a problem that, as described above, the range of changes in parameters, etc. Expert knowledge (know how) etc. is dedicated and cannot be shared, and if the skilled person is not present, it is impossible to set the parameters of the manufacturing equipment to obtain the target result, and in order to obtain the target result, it is necessary to repeat experiments, etc., thus waste time

Method used

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  • Information processing device, information processing method
  • Information processing device, information processing method
  • Information processing device, information processing method

Examples

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Embodiment Construction

[0046] figure 1 It is a block diagram of the information processing device in this embodiment.

[0047] in addition, figure 2 It is a schematic diagram of the manufacturing equipment management system provided with the information processing apparatus in this embodiment.

[0048] The information processing device 10 and the manufacturing device 200 are directly or indirectly connected via a communication line or the like so as to be able to send and receive information. The information processing device 10 and the manufacturing device 200 may be connected via a network such as the Internet, a wireless LAN, or a wired LAN, for example, or may be connected via short-range wireless communication such as Bluetooth (registered trademark). In addition, direct connection via signal lines is also possible. In addition, the information processing device 10 may also be incorporated in the manufacturing device 200 . The information processing device 10 may also be connected to a me...

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Abstract

To solve a problem that the parameter adjustment of semiconductor manufacturing has not been able to be efficiently and speedily performed. An information processing device comprises a target value receiving section (101) for receiving one or more kinds of target values of a semiconductor manufacturing process, a parameter acquiring section (102) for acquiring one or more parameter values at the time of executing the semiconductor manufacturing process, an execution result acquiring section (103) for acquiring one or more kinds of execution results indicating the execution results of the semiconductor manufacturing process, an accumulation section (105) for accumulating the execution results, the target values, and the parameter values in association with one another, a correlation acquiring section (107) for acquiring information on the correlation of the accumulated execution results, target values, and parameter values, an assist information acquiring section (108) for acquiring assist information which is information on a parameter having a high correlation with the target values received by the target value receiving section (101) by using the correlation information acquiredby the correlation acquiring section (107), and an output section for outputting the assist information acquired by the assist information acquiring section.

Description

technical field [0001] The present invention relates to an information processing device or the like used in a semiconductor manufacturing process or the like using a manufacturing device. Background technique [0002] Among the conventional manufacturing methods of semiconductor devices, there is known a method comprising a step of manufacturing the semiconductor device carried out before the manufacturing process of the semiconductor device in one manufacturing process of the semiconductor device. Recording a processing history and inspection results of the process into a computer-readable storage medium; and deciding a processing condition of the one manufacturing process based on the processing history and inspection results recorded in the storage medium; and using at least one computer to perform these steps (for example, refer to Patent Document 1). [0003] However, in the actual semiconductor manufacturing process, even if it is the same manufacturing device, the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/205H01L21/3065
CPCH01L22/20H01L21/67109G05B2219/45031G05B19/41875G05B2219/32187G05B2219/31477H01L2924/0002Y02P90/02H01L2924/00
Inventor 山上宗隆
Owner TOKYO ELECTRON LTD
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