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Dicing/die bonding film
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A chip bonding film and cutting film technology, applied in the direction of pressure-sensitive film/sheet, film/sheet adhesive, thin material processing, etc., can solve the problem of difficult to pick up semiconductor chips, to prevent the disappearance of the boundary surface, reliable High performance, good pick-up effect
Active Publication Date: 2010-12-08
NITTO DENKO CORP
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However, in the case of the dicing / die-bonding film described in Patent Document 3, glue of the adhesive constituting the die-bonding film may pop out on the cut surface after dicing, thereby reattaching (blocking) the cut surfaces to each other.
As a result, there is a problem that it is difficult to pick up semiconductor chips
Method used
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Embodiment 1
[0118]
[0119] In a reaction vessel with a condenser tube, a nitrogen inlet tube, a thermometer and a stirring device, add 86.4 parts of 2-ethylhexyl acrylate (hereinafter referred to as "2EHA"), 13.6 parts of 2-hydroxyhexyl acrylate (hereinafter referred to as "HEA"), 0.2 parts of benzoyl peroxide, and 65 parts of toluene were polymerized in a nitrogen stream at 61° C. for 6 hours to obtain an acrylic polymer A. The HEA is 20 mol%.
[0120] 14.6 parts (80 mol% with respect to HEA) of 2-methacryloyloxyethyl isocyanate (hereinafter referred to as "MOI") was added to this acrylic polymer A, and it was carried out at 50° C. for 48 hours in an air stream. Addition treatment gives acrylic polymer A'.
[0121] Then, 8 parts of polyisocyanate compound (trade name "Coroneto L", manufactured by Nippon Polyurethane Co., Ltd.) and 5 parts of photopolymerization initiator (trade name "Irugakuyua 651", vaporized) were added to 100 parts of acrylic polymer A' Pakistani Chemicals Co., L...
Embodiment 2～10
[0133] About each Examples 2-10, except having changed into the composition and content shown in following Table 1, it carried out similarly to the said Example 1, and produced the dicing / die-bonding film.
[0134] Table 1
[0135]
[0136] Values in parentheses represent moles. However, the numerical values in parentheses in MOI and AOI represent the molar ratio with respect to HEA or 4HBA.
[0137] In addition, the meanings of the abbreviations described in Table 1 and Table 2 described later are as follows.
[0138] 2EHA: 2-Ethylhexyl Acrylate
[0139] HEA: 2-Hydroxyethyl Acrylate
[0140] 4HBA: 4-Hydroxybutyl Acrylate
[0141] AOI: 2-acryloyloxyethyl isocyanate
[0142] C / L: polyisocyanate compound (trade name "Coroneto L", manufactured by Nippon Polyurethane Co., Ltd.)
[0143] C2030: Trade name "Corone 1 To 2030", manufactured by Nippon Polyurethane Co., Ltd.
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Abstract
A dicing / die bonding film is provided which has an excellent balance between semiconductor wafer holding force in dicing and separability in pickup. The dicing / die bonding film comprises: a dicing film constituted of a base and a pressure-sensitive adhesive layer formed thereon; and a die bonding film disposed on the dicing film. The pressure-sensitive adhesive layer is one obtained from a polymer obtained by causing an isocyanate compound having a radical-reactive carbon-carbon double bond to undergo addition reaction with an acrylic polymer containing 10-40 mol% hydroxylated monomer, the amount of the isocyanate compound being 70-90 mol% based on the hydroxylated monomer, and from a crosslinking agent having, per molecule, two or more functional groups reactive with a hydroxy group, theamount of the crosslinking agent being 2-20 parts by weight per 100 parts by weight of the polymer, by curing by ultraviolet irradiation under given conditions. The die bonding film comprises an epoxy resin and is laminated to the pressure-sensitive adhesive layer which had been irradiated with ultraviolet.
Description
technical field [0001] The present invention relates to a dicing / die-bonding film in which an adhesive for fixing a chip-shaped workpiece (semiconductor chip, etc.) and an electrode member is attached to the workpiece (semiconductor wafer, etc.) before dicing and supplied to the workpiece for dicing. Background technique [0002] The semiconductor wafer (work) on which the circuit pattern is formed is diced into semiconductor chips (chip-shaped workpieces) after the thickness is adjusted by back grinding as necessary (dicing process). In the cutting process, in order to remove the cutting layer, generally under moderate hydraulic pressure (usually about 2kg / cm 2 ) to clean the semiconductor wafer. Then, after the aforementioned semiconductor chip is fixed to an adherend such as a lead frame with an adhesive (mounting step), the process proceeds to a bonding step. In the mounting process, an adhesive is applied to a lead frame or a semiconductor chip. However, in this meth...
Claims
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