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Heat releasing semiconductor package

A heat release, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as increased manufacturing costs and increased final product manufacturing costs

Inactive Publication Date: 2010-12-22
DONGBU HITEK CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Because the heat release sheet generally has a multi-layer structure, its manufacturing cost increases, which in turn increases the manufacturing cost of the final product

Method used

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  • Heat releasing semiconductor package
  • Heat releasing semiconductor package
  • Heat releasing semiconductor package

Examples

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Embodiment Construction

[0018] Hereinafter, a heat release semiconductor package, a manufacturing method thereof, and a display device including the heat release semiconductor package according to embodiments will be described with reference to the accompanying drawings.

[0019] example Figure 1A As shown, the heat release semiconductor package 100 according to the embodiment may include: the electrode pattern 20 formed on and / or over the film 10, the semiconductor device 50 mounted on and / or over the electrode pattern 20, and the semiconductor device 50 formed on on and / or over the first heat release layer 90 . The heat release semiconductor package 100 according to the embodiment may be used to release heat emitted from a driver IC mounted on and / or over a tape carrier package (TCP), or from a display panel body (such as a liquid crystal display (LCD) mounted on a semiconductor device utilizing a semiconductor device. ), Plasma Display Panel (PDP), Organic Light Emitting Diode (OLED), Light Emit...

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PUM

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Abstract

A heat releasing semiconductor package, a method for manufacturing the same, and a display apparatus including the same. The heat releasing semiconductor package includes a film, an electrode pattern formed over the film, a semiconductor device mounted over the electrode pattern, and a first heat releasing layer formed over the semiconductor device including the electrode pattern, the first heat releasing layer including a first adhesive and a first heat releasing material.

Description

technical field [0001] Embodiments of the present invention relate to a heat release semiconductor package, a manufacturing method thereof, and a display device including the heat release semiconductor package. Background technique [0002] Generally, heat generated from a driving integrated circuit (IC) for a display device needs to be transferred to the outside in order to prevent heat loss of a product provided with the driving IC. Such a display device may include, for example, a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting diode (OLED), and the like. [0003] LCDs can display images by controlling light transmittance of liquid crystals using an electric field. In order to display images, the LCD may be provided with a liquid crystal panel including a plurality of liquid crystal cells arranged in a matrix structure, and a driving circuit for driving the liquid crystal panel. Compared with cathode ray tubes (CRTs), LCDs can be mi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L23/36
CPCH05K7/20963H01L2924/15153H01L23/3121H01L2924/12044H01L33/641H01L2224/83385H01L2224/32225H01L2224/16H01L2224/32057H01L2224/83051H01L2224/16225H01L2224/27013H01L2924/01006H01L23/36H01L2924/01074H01L2924/14G02F1/13452H01L23/3737H01L2924/01005H01L2924/0103H01L2224/73204H01L2924/01013H01L21/563H01L33/56H01L24/32H01L2924/01033H01L2924/12041H01L2924/00014H01L2924/00011H01L2924/00012H01L2924/00H01L2224/0401
Inventor 金俊一金成振
Owner DONGBU HITEK CO LTD