Magnetron sputtering target holder and magnetron sputtering device comprising same
A magnetron sputtering device and magnetron sputtering technology, applied in the field of magnetron sputtering, can solve the problem of low utilization rate of target materials, and achieve the effects of increasing the effective area, improving the utilization rate and cooling effect
Inactive Publication Date: 2013-07-31
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
[0003] However, the actual use area of the target corresponding to the magnetron sputtering target seat is an annular area, so the utilization rate of the target is relatively low
Method used
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Embodiment Construction
[0010] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0011] see figure 1 , is the magnetron sputtering device 200 provided in the first embodiment of the present invention, which includes a target 21, a magnetron sputtering target holder 20 for carrying the target 21, and a stand opposite to the target 21 The coated substrate 23 and a base 27 for carrying the substrate to be coated 23 . The magnetron sputtering device 200 is placed in a coating chamber (not shown) filled with argon gas.
[0012] To further illustrate, the so-called magnetron sputtering refers to adding an orthogonal magnetic field and an electric field between the cathode (usually used to place the target 21) and the anode (usually used to place the base 27 of the substrate 23 to be coated). The coating chamber is filled with the required inert gas (usually argon), and under the action of the electric field, the argon is io...
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The invention relates to a magnetron sputtering target holder for bearing a target, which comprises a magnet assembly, a cooling water channel and a bearing part, wherein the bearing part is used to bear the magnetic assembly and the cooling water channel and enables the magnet assembly to abutt the surface of the target, the magnet assembly is composed of a plurality of rows of magnet pillar sets which are arranged at intervals, and each row of the magnet pillar sets comprises a plurality of magnet pillars which are accommodated on the bearing part, the like magnetic poles of all the magnet pillars in the same row have the same orientation to form a magnetic pole, and the magnetic poles formed by two adjacent rows are opposite. The cooling water channel rounds among the rows of the magnet pillar sets. By forming a plurality of magnetic fields through the rows of magnet pillar sets accommodated on the bearing part at intervals and rounding the cooling water channel among the rows of the magnet pillar sets, the effective area on the surface of the target, impacted by ionized gas molecules by means of a plurality of the magnetic fields, and the effective area for target cooling are enlarged, and the utilization ratio and the cooling effect of the target are improved. The invention further relates to a magnetron sputtering device with the magnetron sputtering target holder.
Description
technical field [0001] The invention relates to a magnetron sputtering technology, in particular to a magnetron sputtering target seat and a magnetron sputtering device with the magnetron sputtering target seat. Background technique [0002] At present, the existing magnetron sputtering target holder for carrying a target includes a carrier, a first magnet group arranged in a ring, a second magnet group arranged in a straight line, and an annular cooling water channel . The first magnet group surrounds the second magnet group, and the annular cooling water circuit surrounds the second magnet group and is surrounded by the first magnet group. The supporting part is used to carry the first magnet group, the second magnet group and the annular cooling water channel, and make the first magnet group and the second magnet group abut against the surface of the target. The S pole of the first magnet group is close to the target, the N pole of the second magnet group is close to th...
Claims
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IPC IPC(8): C23C14/50C23C14/35
Inventor 蔡泰生
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD