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Semiconductor packaging component

A semiconductor and packaging technology, applied in the field of semiconductor packaging, can solve the problems of poor filling sealing, filling particles are not easy to enter, sealing glue flow is not smooth, etc.

Active Publication Date: 2011-01-05
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, a part of the solder balls of the flip chip is trapped in the opening, so that the distance between the protective layer and the flip chip is small, resulting in poor flow of the liquid encapsulant during the packaging process, poor filling performance and The filling particles of the sealant are not easy to enter, etc.

Method used

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  • Semiconductor packaging component
  • Semiconductor packaging component
  • Semiconductor packaging component

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Embodiment Construction

[0042] Please refer to figure 1 and figure 2 , figure 1 A cross-sectional view illustrating a semiconductor package according to a preferred embodiment of the present invention, figure 2 draw figure 1 Cross-sectional view of a semiconductor component before bonding to a substrate. Such as figure 1 As shown, the semiconductor package 100 is, for example, a Flip Chip CSP (FCCSP), which includes a substrate 102 , a semiconductor component 104 , several component contacts 106 , encapsulant 108 and substrate contacts 110 . The substrate contacts 110 are, for example, solder balls, which are used to electrically connect an external circuit with the semiconductor package 100 . The encapsulant 108 contains filler particles 122 , and the maximum size of the filler particles 122 is preferably between about 18-23 micrometers (μm).

[0043] The substrate 102 includes a substrate 140 , a substrate protection layer 112 and a plurality of substrate pads 114 . The substrate protectio...

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Abstract

The invention relates to a semiconductor packaging component which comprises a substrate, a semiconductor assembly, a plurality of assembly points and packaging glue. The substrate comprises a protective layer and a plurality of substrate gaskets, each substrate gasket comprises a protruding part and an embedding part which is embedded in the protective layer, and the protruding part protrudes out of the protective layer, the semiconductor assembly comprises a plurality of bottom protrusion metals with grooves, the ratio of the groove width of the grooves to the first width is more than 1, the assembly points are connected with the bottom protrusion metals and the substrate gaskets, and the semiconductor assembly is coated by the packaging glue.

Description

technical field [0001] The present invention relates to a semiconductor package, and in particular to a flip chip CSP semiconductor package. Background technique [0002] A traditional semiconductor package includes a substrate, a flip chip, and a molding compound. The encapsulant includes a certain proportion of fillers. The encapsulant covers the semiconductor package and fills between the flip chip and the substrate, so as to fix the solder balls of the flip chip and make the flip chip firmly bonded to the substrate. [0003] The substrate includes several pads and a protective layer, and the protective layer has openings to expose the pads. Generally speaking, according to the difference in the structure of the pad and the protective layer, the design of the semiconductor package is divided into solder mask defined (Solder Mask Defined, SMD) and non-solder mask defined (Non-solder Mask Defined, NSMD). However, the pads are lower than the upper surface of the protective...

Claims

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Application Information

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IPC IPC(8): H01L23/488
CPCH01L2224/16225H01L2924/15311
Inventor 高崇尧李又儒黄士洪赖振铭
Owner ADVANCED SEMICON ENG INC
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