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Three-dimensional temperature measurement imaging system and measuring method thereof

An imaging system and measurement method technology, applied in measurement devices, temperature recording methods, optical radiation measurement, etc., can solve problems such as difficulty in application and marking, and achieve the effect of improving accuracy and avoiding asynchronous

Active Publication Date: 2011-01-12
卢家金
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  • Claims
  • Application Information

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Problems solved by technology

However, this method does not have feature points on the surface of medium-high temperature objects that generate heat, and feature points cannot be marked on the surface, so this method is difficult to apply

Method used

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  • Three-dimensional temperature measurement imaging system and measuring method thereof
  • Three-dimensional temperature measurement imaging system and measuring method thereof
  • Three-dimensional temperature measurement imaging system and measuring method thereof

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Embodiment Construction

[0023] Such as figure 1 As shown, the system of the present invention includes the following components along the optical path:

[0024] 1) Optical lens group 1: including at least three groups of optical lens groups 1, each group of optical lens groups 1 includes a convex lens and a noise reduction aperture, the optical lens group 1 collects the radiation signals of the surfaces of the temperature-measured object, and performs noise reduction on the signals, For collimation, at least three groups of optical lens groups are respectively installed around the measured object, preferably four groups are arranged in a tetrahedral shape, and the angle between each two groups of optical lens groups 1 and the center of the measured object is 109.4 degrees. Four sets of optical lens group 1 can cover the radiation information of all surfaces of the object, and at the same time can obtain the necessary spatial information for three-dimensional reconstruction, while the three optical le...

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Abstract

The invention provides a low-cost three-dimensional temperature measurement imaging system. The system avoids the problem of synchronization discrepancy caused by multiple imaging elements, and can reconstruct the three-dimensional structure of medium and high temperature objects. The three-dimensional temperature measurement imaging system comprises at least three optical lens sets, an image transmission fiber, an imaging element and a signal processor, wherein the imaging element is a monolithic chromatic CCD or CMOS imaging element. The non-contact high-low-temperature object surface imaging temperature measurement system and method based on heat source radiation can compare multiple image signals so as to detect the temperature measurement boundary of the object, calculate the surface temperature of an object to be measured by using the multiband heat source radiation temperature algorithm and the system features, and characterize the temperature field of the surface of the measured object in a three-dimensional mode.

Description

technical field [0001] The invention relates to a three-dimensional temperature measuring imaging system and a measuring method thereof. Background technique [0002] At present, the common temperature measurement imaging system is mainly based on infrared photosensitive elements, and its structure mainly includes optical lenses, infrared imaging photosensitive elements and signal processing units. The sensing light wavelength of photosensitive elements is usually above 1 micron. The advantage of this type of temperature measurement imaging system is that it can measure lower temperatures, even including objects at room temperature. The disadvantage is that the cost is high, mainly because the cost of infrared imaging photosensitive elements is much higher than that of other visible light and near-infrared imaging elements. [0003] In recent years, most CCD-based temperature measurement and imaging systems are based on multiple CCD cameras or multiple CCD elements. The radi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/00G01J5/10G01J5/48
Inventor 卢家金
Owner 卢家金
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