LED glue pouring method
An LED module and glue filling technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of large floor space, high equipment cost, difficult maintenance, etc., to achieve small equipment footprint, reduce production costs, and smooth high degree of effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0032] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0033] Such as figure 1 As shown, the utility model provides a LED glue filling method, which includes the following steps:
[0034] Step 1. Set up a transport track for first-line operation to transport the carrier;
[0035] Step 2. Place the LED module on the carrier, and place the carrier on the transmission track, and transfer the carrier to the station of the glue filling machine through the transmission track for glue filling. In this step 2, use a fully automatic glue filling machine to glue the LED The module is filled with glue;
[0036] Step 3. The LED module after the glue is filled is transported to the drying access station through the transmission track. The drying access station includes two rows of oppositely arranged shelves...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 