Method for manufacturing patterned substrate on lithium aluminate wafer
A patterned substrate and lithium aluminate technology, which is applied in manufacturing tools, welding equipment, laser welding equipment, etc., can solve problems such as difficulty in obtaining high-quality lithium aluminate patterned substrates
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[0034] An embodiment of a method for growing a GaN epitaxial film on a lithium aluminate pattern substrate provided by the present invention includes:
[0035] Provide lithium aluminate wafer;
[0036] Scanning the surface of the lithium aluminate wafer with a femtosecond laser to form a plurality of roughly parallel grooves to obtain a pattern substrate of the lithium aluminate wafer, the crystal plane of the lithium aluminate wafer is a (100) crystal plane;
[0037] A (10-10) plane GaN epitaxial film is grown on the pattern substrate.
[0038] Another embodiment of the method for growing a GaN epitaxial film on a lithium aluminate pattern substrate provided by the present invention includes:
[0039] Provide lithium aluminate wafer;
[0040] Scanning the surface of the lithium aluminate wafer with a femtosecond laser to form a plurality of roughly parallel grooves to obtain a pattern substrate of the lithium aluminate wafer, the crystal plane of the lithium aluminate wafer...
Embodiment 1
[0045] A lithium aluminate wafer with a (302) crystal plane is prepared, the root mean square roughness of the surface of the lithium aluminate wafer is 3 angstroms, and the lithium aluminate wafer is fixed on a sample stage.
[0046] The sample stage moves along the [203] direction at a speed of 5 μm / s, and the femtosecond laser 2 The power acts on the crystal plane of the lithium aluminate wafer to form a first trench with a depth of 30 nm and a width of 30 nm.
[0047] Then the sample stage is moved perpendicular to the [203] direction with a moving distance of 30 nm. Then move the sample stage along the [203] direction at a speed of 5 μm / s, and use a femtosecond laser at 3 J / cm 2 The power acts on the crystal plane of the lithium aluminate wafer to form a second trench with a depth of 30 nm and a width of 30 nm.
[0048] The above etching process was repeated to form a plurality of parallel grooves with a pitch of 30 nm to obtain a lithium aluminate wafer pattern substra...
Embodiment 2
[0051] A lithium aluminate wafer with a (100) crystal plane is prepared, the root mean square roughness of the surface of the lithium aluminate wafer is 5 angstroms, and the lithium aluminate wafer is fixed on a sample stage.
[0052]The sample stage moves along the [001] direction at a speed of 100 μm / s, and a femtosecond laser is used at 8 J / cm 2 The power acts on the crystal surface of the lithium aluminate wafer to form a first groove with a depth of 20 μm and a width of 20 μm.
[0053] Then the sample stage was moved perpendicular to the [001] direction with a moving distance of 20 μm. Then move the sample stage along the [001] direction at a speed of 100 μm / s, and use a femtosecond laser at 8 J / cm 2 The power acts on the crystal plane of the lithium aluminate wafer to form a second trench with a depth of 20 μm and a width of 20 μm.
[0054] The above etching process was repeated to form a plurality of parallel grooves with a pitch of 20 μm to obtain a lithium aluminate...
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