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Manufacture method and usage of folded system-in-package

A system-in-package, circuit board technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems affecting circuit boards and other issues

Inactive Publication Date: 2013-09-11
FLEXTRONICS AP LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But today, the increased pressure to minimize the overall size of electronic devices also continues to affect the circuit boards that provide control and power to said electronic devices

Method used

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  • Manufacture method and usage of folded system-in-package
  • Manufacture method and usage of folded system-in-package
  • Manufacture method and usage of folded system-in-package

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Embodiment Construction

[0025] Reference will now be made to the accompanying drawings, which help illustrate various relevant features of the present invention. Although the present invention is mainly described in connection with a stacked system-in-package, the stacked system-in-package includes stacked or stacked circuit board modules for driving a pico-projector light engine The ultra-micro projector is implemented in handheld devices such as mobile phones or digital cameras, but it can be clearly understood that the present invention is also applicable to other applications where it is desired to stack or stack multiple circuit board modules. The following description is for the purpose of illustration and description, and is not intended to limit the present invention to the form disclosed herein. Therefore, changes and modifications adapted to the following teachings and skills and knowledge in related fields are also within the scope of the present invention. The embodiments described here a...

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Abstract

A folded system-in-package (SiP) assembly is provided for minimizing the footprint of two corresponding circuit board modules in a handheld electronic device. The assembly includes top and bottom circuit board modules that are electrically interconnected through a flex circuit. Either a plate or wrapped heat spreader may be thermally coupled to the top circuit board module to conduct heat from the heat-generating components mounted to the top circuit board module and to a case of the electronic device.

Description

Technical field [0001] The present technology relates to stacking system-in-package and its manufacturing and use methods. Background technique [0002] In the field of consumer electronic devices, such as wireless phones and portable music players, there is constant pressure to make these devices more compact, cheaper, and more distinctive. As a result, these device manufacturers put the same pressure on each of their suppliers. Traditionally, larger circuit boards should be used to accommodate these additional, often more powerful electronic components needed to provide these desired features. But today, the pressure to minimize the increase in the overall size of electronic devices continues to affect the circuit boards that provide control and power for the electronic devices. [0003] Therefore, when more robust functions are added to the device circuit, the semiconductor package containing the device circuit must continue to shrink in size. Early semiconductor packaging te...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/00H01L23/52H01L23/34H01L21/50
CPCH01L2924/10253H01L25/0652H01L2224/48227H01L2224/48145H01L2924/30107H01L2924/3025H01L2225/0651Y10T29/49126H01L2924/00H01L2924/00012
Inventor 塞缪尔·塔姆尤尼斯·沙巴尼
Owner FLEXTRONICS AP LLC