Printed circuit board test assisting apparatus and printed circuit board test assisting method
A printed circuit board and auxiliary equipment technology, applied in the field of printed circuit board test auxiliary equipment and printed circuit board test aids, can solve the problems of difficult wiring test, unproposed, etc.
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Embodiment 1
[0038] figure 1 The figure shows a perspective view of a computer system to which the auxiliary equipment for printed circuit board testing in Embodiment 1 is applied. figure 1 The computer system 10 shown in FIG. 1 includes a main body 11 , a display 12 , a keyboard 13 , a mouse 14 and a modem 15 .
[0039] The main body portion 11 incorporates a CPU (Central Processing Unit), HDD (Hard Disk Drive), a disk drive, and the like. The display 12 functions as a display section that displays analysis results and the like on the display screen 12A in response to an instruction given from the main body section 11 . Display 12 may be, for example, a liquid crystal display monitor. The keyboard 13 serves as an input section for inputting various types of information into the computer system 10 . The mouse 14 serves as an input section for designating an arbitrary position on the display screen 12A of the display 12 . The modem 15 is used to access an external database and the like,...
Embodiment 2
[0163] In Embodiment 1 described above, the degree of deterioration of the signal characteristic is calculated as a result of calculating the degree of deterioration of the characteristic impedance. The printed circuit board test auxiliary device in Embodiment 2 is different from the device in Embodiment 1 in that when the degree of degradation of signal characteristics is calculated, the degree of degradation of signal characteristics caused by crosstalk is calculated.
[0164] As used to describe Example 1 Figure 4 As shown in , in the case where the wiring pattern 6 and the solid pattern removal regions 8A and 8B are close together, when there is a dielectric layer 5e (which is a layer below the dielectric layer 5d formed with the solid pattern removal regions 8A and 8B), When the wiring pattern 6 on the layer) approaches the solid pattern removal regions 8A and 8B, crosstalk may occur between the wiring patterns via the solid pattern removal regions 8A and 8B. Crosstalk ...
Embodiment 3
[0209] According to the printed circuit board testing auxiliary device in Embodiment 1 described above, the degradation degree calculation section 215 obtains a specific value of the characteristic impedance. The printed circuit board testing auxiliary apparatus in Embodiment 3 is different from that in Embodiment 1 above in that the degradation degree calculation section 215 utilizes the solid pattern shift existing from the start point to the end point of the wiring pattern 6. Divide the area of the region 8 to determine the degree of degradation of the signal characteristics. That is, according to the printed circuit board testing aid in Embodiment 3, the area of the solid pattern removal region 8 is used as a value representing the degree of deterioration of the characteristic impedance. The other configurations of Embodiment 3 are the same as those of the printed circuit board testing auxiliary apparatus in Embodiment 1, and the same parts / components are given the sam...
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