Method for testing contact thermal resistance of GH4169/GH4169 by additional heating

Abstract

The invention discloses a method for testing the contact thermal resistance of GH4169 / GH4169 by additional heating, which comprises the following steps of: firstly, determining a reduced elastic modulus between two materials; secondly, modeling according to a plastic deformation theory; thirdly, simplifying a model; and finally, determining unknown parameters through a stepwise regression test toobtain an optimal regression equation; obtaining contact thermal conductance hs according to a regression analysis result, wherein hs is 145583796.6T0.159P-1.932 when temperature and pressure values are independent variables and the temperature is between 100 and 600 DEG C, and hs is 165751460.8P-1.863 when only the pressure value is an independent variable; and obtaining the contact thermal resistance R according to a formula R=1 / hs, wherein test data required by the regression test is obtained by a contact thermal resistance test, and temperature compensation is performed on a contact interface of two samples in the testing process. By the method, the required parameters can be obtained only according to the test data, and the contact thermal resistance can be obtained according to a simple formula under the condition of arbitrarily changing test temperature and test pressure, so that the contact thermal resistance testing process is simple and can be reused.

Description

technical field [0001] The invention belongs to the technical field of contact thermal resistance testing, in particular to a method for compensating heating to test the contact thermal resistance of GH4169 / GH4169. Background technique [0002] Many models, empirical and semi-empirical relations for predicting contact conductance have been proposed in the past few decades. The classic models include the Mikic elastic model, the CMY (Cooper, Mikic and Yovanovich) plastic model, and the elastic-plastic deformation model by Sridar and Yovanovich. The theoretical research in China is mainly reflected in the numerical simulation of contact thermal resistance. [0003] In the prior art, the contact thermal resistance test of two high-temperature materials is carried out through a large number of tests. The test process is to select the interface material and process it into a sample with a certain size and a certain interface roughness, and then pressurize and heat the interface....

AI Technical Summary

Problems solved by technology

[0004] Although the existing test technology can accurately obtain the contact heat conduction under the conditions of given temperature, pressure and interface roughness, due to the complexity of the test process and relatively fixed test conditions, it cannot meet the changing temperature and pressure conditions in engineering applications. Unable to provide timely and accurate contact thermal conductivity data at the material interface

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