Water-reactive Al composite material, water-reactive Al film, process for production of the Al film, and constituent member for film depostion chamber

A composite material and manufacturing method technology, applied in metal material coating process, ion implantation plating, gaseous chemical plating and other directions, to achieve the effects of easy cost, easy recovery, and increased reuse times

Active Publication Date: 2011-04-13
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the status quo is that only film-forming materials with a unit price offset by the recycling cost are recycled

Method used

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  • Water-reactive Al composite material, water-reactive Al film, process for production of the Al film, and constituent member for film depostion chamber
  • Water-reactive Al composite material, water-reactive Al film, process for production of the Al film, and constituent member for film depostion chamber
  • Water-reactive Al composite material, water-reactive Al film, process for production of the Al film, and constituent member for film depostion chamber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Based on the results of Comparative Example 1, 4NAl was used to study the amount of Bi added, the amount of Si added, and the dissolution of the resulting thermally sprayed coating in the Al-Bi-Si composition to which Bi and Si (the total amount of impurity Si) were added. sexual relationship. The amounts of Bi and Si added are based on Al weight.

[0061] 4NAl-1wt%Bi (impurity Si: 90ppm)

[0062] 4NAl-1wt%Bi-0.25wt%Si (impurity Si: 90pm)

[0063] 4NAl-1wt%Bi-0.5wt%Si (impurity Si: 100ppm)

[0064] 4NAl-1.4wt%Bi-0.7wt%Si (impurity Si: 100ppm)

[0065] 4NAl-1wt%Bi-0.85wt%Si (impurity Si: 100ppm)

[0066] Using a thermal spraying material that mixes Al, Bi, and Si in the above-mentioned proportions, dissolves Bi and Si uniformly in Al, and processes it into a rod shape, it is sprayed by molten rod flame spraying (heat source: C 2 h 2 -O 2 gas, about 3000°C), in the air atmosphere, spray on the surface of the aluminum substrate to form a sprayed coating. Each of th...

Embodiment 2

[0071] Using a sputtering device provided with an anti-adhesion plate coated with the 4NAl-1wt% Bi-0.5wt% Si sprayed film (film thickness 200 μm) obtained in Example 1, after implementing platinum (Pt) film formation for 30 cycles, The anti-adhesion plate to which the Pt was attached was removed and treated with warm water at 80°C. As a result, the sprayed coating was dissolved in 20 minutes, as shown in image 3 As shown in , the adhered film of Pt was peeled off from the antiadhesive plate. Therefore, Pt as a film-forming material can be easily recovered. At this time, AlOOH was precipitated in warm water.

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Abstract

A water-reactive Al composite material which consists essentially of 4N Al (aluminum having a purity of 99.99%) or 5N Al (aluminum having a purity of 99.999%), 0.8 to 1.4wt% of Bi, and 0.25 to 0.7wt% (in total) of Si inclusive of contaminant Si, with each percentage being based on Al; an Al sprayed film produced by using the material; production of the Al film; and a constituent member for a film deposition chamber, which member is provided with the Al sprayed film on the surface.

Description

technical field [0001] The present invention relates to a water-reactive Al composite material, a water-reactive Al film, a method for producing the Al film, and components for a film-forming chamber, and particularly to a water-reactive Al composite material to which Bi and Si are added, and a water-reactive Al composite material made of the water-reactive Al film. A water-reactive Al film formed of a reactive Al composite material, a method for producing the Al film, and a film-forming chamber component covered with the Al film. Background technique [0002] In a film-forming device for forming a thin film by sputtering, vacuum evaporation, ion plating, CVD, etc., the components for the film-forming chamber installed in the device are inevitably A film of a metal or a metal compound formed from a film-forming material is adhered. As the components for the film forming chamber, for example, an anti-adhesion plate (anti-adhesion plate) for preventing the film from adhering ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/06C22C21/00C23C14/00C23C16/44
CPCC23C4/18C23C4/06C23C14/564C23C16/4404C23C16/4407C22C21/00C23C4/08
Inventor 门胁丰斋藤朋子林敬荣虫明克彦
Owner ULVAC INC
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