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Power module

A technology for power modules and electrode terminals, which is applied to electrical components, electrical solid devices, circuits, etc., can solve the problems that the height and dimensional accuracy of electrode terminals cannot meet the specified standards and the reliability is reduced.

Inactive Publication Date: 2011-04-20
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When bending with special fixtures, etc., there is a problem that it cannot be bent into a right angle, so that the height and dimensional accuracy of the electrode terminal cannot meet the specified standards.
In addition, when bending, there is a problem that stress is applied to the solder joint, reducing reliability

Method used

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Experimental program
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Effect test

Embodiment 1

[0025] First, a power module according to Embodiment 1 of the present invention will be described with reference to the drawings. figure 1 is a top view showing the power module, figure 2 is along figure 1 Cutaway view of the power module of the A-A line, image 3 is along figure 1 Cutaway view of the power module of the B-B line, Figure 4 is a cross-sectional view showing a power module of a comparative example, Figure 5 It is a cross-sectional view showing the shape of the power module of the comparative example immediately after bending the electrode terminal. Image 6 It is a graph showing the deviation of the height dimensional tolerance of the electrode terminal. In this embodiment, after the electrode terminal having the electrode terminal bending portion bent into a “U” shape is connected to the upper electrode of the circuit board, the nut and the nut clip are stored in the electrode terminal bending portion. inside.

[0026] Such as figure 1 As shown, in t...

Embodiment 2

[0054] Next, a power module according to Embodiment 2 of the present invention will be described with reference to the drawings. Figure 9 is a sectional view showing the power module. In this embodiment, the shape of the electrode terminal is changed.

[0055] Hereinafter, the same reference numerals are assigned to the same components as those in Embodiment 1, and descriptions of these components are omitted, and only different components will be described.

[0056] Such as Figure 9 As shown, the emitter terminal 5EE is formed in the power module 81, wherein the emitter terminal 5EE is provided with an electrode terminal bending part 31 bent into a "U" shape, and one end and the other end of the top end of the electrode terminal bending part 31 are (The first connection portion and the second connection portion) are provided in a direction perpendicular to the electrode terminal bent portion 31 .

[0057] The emitter terminal 5EE is joined to the upper electrode 21 of th...

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PUM

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Abstract

According to one embodiment, a power module includes a metal base, a ceramic substrate, a semiconductor chip, a nut holder housing a nut, an electrode terminal and a casing. The ceramic substrate is connected to an upper surface of the metal base via a lower electrode. The semiconductor chip is located on a first major surface of the ceramic substrate. The electrode terminal includes a bent portion surrounding a nut holder. The electrode terminal includes a first connecting portion extending perpendicularly to the bent portion from one end of the bent portion, and being located on the first major surface via an upper electrode, and electrically connected to the semiconductor chip. A casing is bonded to the metal base to enclose the semiconductor chip and the electrode terminal. An upper end portion of the bent portion of the electrode terminal is exposed to outside of the casing through the opening.

Description

[0001] This application is based on and claims priority from Japanese Patent Application No. 2009-216417 filed on September 18, 2009, the entire content of which is incorporated herein by reference. technical field [0002] The present invention relates to power modules. Background technique [0003] In the power module, between the upper electrode and the electrode terminal of the circuit board on which the semiconductor chip as the power device is mounted, and between the lower electrode of the circuit board and the metal base are joined together by solder, and the circuit board The gap between the case and the case is filled with silicone gel or the like. In power modules such as IGBT (Insulated-Gate Bipolar Transistor: Insulated Gate Bipolar Transistor) modules, ceramic substrates such as AlN (aluminum nitride) are used for the circuit substrate, and Cu ( Copper) etc. (For example, refer to Unexamined-Japanese-Patent No. 2005-311019). [0004] In the power module descr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/498
CPCH01L23/24H01L2224/48472H01L2224/48227H01L2924/01322H01L2924/13091H01L25/072H01L2924/13055H01L2924/01079H01L2224/73265H01L2924/1305H01L2924/00
Inventor 中尾淳一福吉宽
Owner KK TOSHIBA