High frequency storing case and high frequency module

Abstract

A high frequency storing case is provided with a cavity (5) wherein a grounding conductor (4), which is formed on a multilayer dielectric substrate (2) and has a plurality of high frequency circuits (10, 11, 12) mounted on the grounding conductor, and a shield cover material (3) are electrically connected; a waveguide tube opening (30), which is formed on the grounding conductor (4) whereupon thehigh frequency circuits (10, 11, 12) are mounted and is electrically coupled with the cavity (5); and a dielectric waveguide tube (40) having a short-circuiting leading end, which is formed in the laminating direction of the multilayer dielectric substrate (2), connected to the waveguide tube opening (30) and has a length substantially 1 / 4 of the effective wavelength of a signal wave in the substrate. Spatial isolation among the high frequency circuits is ensured by low-cost and simple configuration wherein the single cavity is used.

Description

technical field [0001] The present invention relates to a high-frequency storage box and a high-frequency module that constitute a cavity that is electromagnetically shielded by a multilayer dielectric substrate on which a plurality of high-frequency circuits is mounted and a shield cover covering the multilayer dielectric substrate. Background technique [0002] For high-frequency packages that carry high-frequency circuits that operate in high-frequency bands such as microwave and millimeter wave bands, they are often mounted in an inner cavity that is electrically shielded by a metal frame, etc., in consideration of operational stability and EMI (radioactive parasitic) standards. Inside. [0003] In Patent Document 1, in order to avoid spatial interference between semiconductor chips with different functions, the package assembly is divided into multiple partitions (inner cavities) by using sealing rings or individual covers. The semiconductor chips are mounted, and the ...

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Problems solved by technology

[0005] However, this packaging structure in the prior art has many problems in terms of cost and reliability, such as increasing the number of components such as sealing rings and covers, or complicating the manufacturing processes such as soldering of the package and welding of the cover, etc.

In addition, in high-frequency bands such as the millimeter wave band, the chip size is on the order of wavelengths (about 1mm), so shielding and partitioning cannot be performed with the physical size of the cut-off cavity, and resistors / magnetic materials, etc. have to be used. expensive absorbent material

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