High frequency storing case and high frequency module

Abstract

A cavity 5 that is configured by electrically connecting an earth conductor 4 that is formed on a multilayer dielectric substrate 2 and on which a plurality of high frequency circuits 10, 11, and 12 are mounted, and a shield cover member 3; a waveguide aperture 30 that is formed on the earth conductor 4 on which the high frequency circuits 10, 11, and 12 are mounted and that is electrically coupled to the cavity 5; and an end-short-circuited dielectric waveguide 40 that is formed in a direction of layer lamination of the multilayer dielectric substrate 2, is connected to the waveguide aperture 30, and has a length approximately 1 / 4 of an effective wavelength in the substrate of a signal wave are included, and spatial isolation between the high frequency circuits is ensured by an inexpensive and simple configuration using the single cavity.

Description

technical field [0001] The present invention relates to a high-frequency storage box and a high-frequency module that constitute a cavity that is electromagnetically shielded by a multilayer dielectric substrate on which a plurality of high-frequency circuits is mounted and a shield cover covering the multilayer dielectric substrate. Background technique [0002] For high-frequency packages that carry high-frequency circuits that operate in high-frequency bands such as microwave and millimeter wave bands, they are often mounted in an inner cavity that is electrically shielded by a metal frame, etc., in consideration of operational stability and EMI (radioactive parasitic) standards. Inside. [0003] In Patent Document 1, in order to avoid spatial interference between semiconductor chips with different functions, the package assembly is divided into multiple partitions (inner cavities) by using sealing rings or individual covers. The semiconductor chips are mounted, and the ...

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Problems solved by technology

[0005] However, this packaging structure in the prior art has many problems in terms of cost and reliability, such as increasing the number of components such as sealing rings and covers, or complicating the manufacturing processes such as soldering of the package and welding of the cover, etc.

In addition, in high-frequency bands such as the millimeter wave band, the chip size is on the order of wavelengths (about 1mm), so shielding and partitioning cannot be performed with the physical size of the cut-off cavity, and resistors / magnetic materials, etc. have to be used. expensive absorbent material

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