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Machining device for tantalum ring fixing component
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A processing device and a technology for fixing components, applied in the field of semiconductor manufacturing, can solve the problems of high processing cost and low processing efficiency, and achieve the effects of reducing processing cost, improving processing efficiency and reducing area
Active Publication Date: 2012-12-05
KONFOONG MATERIALS INTERNATIONAL CO LTD
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Problems solved by technology
[0005] In order to solve the above-mentioned technical problems, the object of the present invention is to provide a processing device for a tantalum ring fixing assembly, so as to solve the problems of high processing cost and low processing efficiency in the existing processing scheme of a tantalum ring fixing assembly
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Embodiment 1
[0037] see Figure 4 As shown, it is a schematic structural view of the processing device of the tantalum ring fixing assembly provided in this embodiment. The processing device includes:
[0038] A cylindrical body 401 with a cylinder 402 in its center area;
[0039] The cylindrical top surface 4011 of the main body includes a raised first cutting body 403 and a second cutting body 404, and the first cutting body 403 and the second cutting body 404 are symmetrical about the center of the main body;
[0040] The first cutting body 403 and the second cutting body 404 respectively include a front end and a rear end, and the height of the front end is greater than the height of the rear end;
[0041] There is a height difference between the front end of the first cutting body 403 and the cylindrical top surface 4011 of the main body 401, forming a first cutting surface 4031;
[0042] There is a height difference between the front end of the second cutting body 404 and the cylin...
Embodiment 2
[0053] see Figure 5 As shown, it is a schematic structural diagram of the processing device of the tantalum ring fixing assembly provided in this embodiment. The processing device includes:
[0054] The cylindrical body 501 has a cylinder 502 in its center area;
[0055] The cylindrical top surface of the main body includes a raised first cutting body 503 and a second cutting body 504, the first cutting body and the second cutting body are symmetrical about the center of the main body;
[0056] The first cutting body 503 and the second cutting body 504 respectively include a front end and a rear end, and the height of the front end is greater than the height of the rear end;
[0057] The front end of the first cutting body 503 is connected to the rear end of the second cutting body 504, and there is a height difference between the front end of the first cutting body and the rear end of the second cutting surface, forming the first cutting surface 5031;
[0058] The front en...
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Abstract
The embodiment of the invention discloses a machining device for a tantalum ring fixing component. The machining device comprises a cylinder-shaped main body, a column is arranged in the center area of the cylinder-shaped main body, the cylinder-shaped top surface of the main body comprises a first convex cutting body and a second convex cutting body, and a first cutting surface as well as a second cutting surface is formed by the height difference between the front end of the first cutting body and the main body as well as that between the front end of the second cutting body and the main body. When the technical scheme provided by the embodiment of the invention is applied, the column arranged in the machining device is matched with a concave area in the center of the tantalum ring fixing component, and the area of each cutting surface is enabled to be reduced through the first cutting surface and the second cutting surface, so that the abrasion or the damage of the machining deviceis reduced, and the machining cost is decreased. At the same time, the machining device needs not to be frequently replaced when the groove of the tantalum ring fixing component is machined, so that the production efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a processing device for a tantalum ring fixing component. Background technique [0002] Currently, sputtering is generally used to form electrode films on the surface of semiconductor structures. Sputtering is a physical vapor deposition (PVD) coating method, which bombards the target with charged particles, causes the surface atoms of the target to collide and transfer energy and momentum, and the target atoms escape from the surface and deposit process on the substrate. Metal, alloy or dielectric films can be formed on the substrate surface by sputtering process. Since the direction of the charged particles bombarding the target is uncertain, the directionality of the target atoms escaping from the target surface is poor, that is, the target atoms will leave the target surface from various angles, and then reach the substrate surface along a straight line ...
Claims
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Application Information
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