System and method of flexibly transmitting semiconductor component in high speed

Abstract

Provided is a system for transmitting a semiconductor component, comprising a turntable structure, a first bearing body, a second bearing body and a group pick-and-place mechanism. A mesa structure comprises a central shaft and a plurality of pickup heads rotating around the shaft. The pickup head can move while rotating, and transmit the semiconductor components among processing modules to process the components. The semiconductor components are successively transmitted to the first and the second bearing bodies from the pickup head. The semiconductor components are transmitted together to a packaging medium by the group pick-and-place mechanism from the first and the second bearing bodies. The pickup heads move up and down in real time among a processing bench, two bearing bodies and the group pick-and-place mechanism. The two bearing bodies are mutually operated in a manner of circulating movement, thereby the components are transmitted from the mesa structure to a classification position. The group pick-and-place mechanism is used for arranging the components in groups from the two bearing bodies in an output tray, so that the system UPH can be reinforced.

Description

technical field [0001] The present invention generally relates to systems and methods for handling semiconductor components. More particularly, the present invention relates to systems and methods for transferring semiconductor components between different packaging media. Background technique [0002] Semiconductor components such as semiconductor wafers, dies, and integrated circuit (IC) chips are typically packaged or stored in suitable packaging media (also known as transport medium or transmission medium). Packaging media for semiconductor components are generally divided into loose packaging media and immobilizing packaging media. Bare packaging media used to package semiconductor components include, but are not limited to, JEDEC trays, TESEC trays, multi-lane metal boxes, and tubes. An example of a fixed packaging medium is a tape medium. [0003] It is often necessary to transfer semiconductor components between different types of packaging media such as multi-la...

AI Technical Summary

Problems solved by technology

Furthermore, most conventional systems and methods for processing semiconductor components have undesirably limited speed and accuracy in processing semiconductor components

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