Vacuum processing system and vacuum processing method of semiconductor processing substrate

Abstract

The invention provides a device, in which the arrangement of a vacuum processing chamber in a vacuum transfer chamber is optimized and the production performance of the objects to be processed in unit area is high. The invention provides a vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same, comprising an atmospheric transfer chamber having a plurality of cassette stands, a lock chamber arranged on a rear side of the atmospheric transfer chamber, and a first vacuum transfer chamber connected to a rear side of the lock chamber, wherein the first vacuum transfer chamber does not have any vacuum processing chamber connected thereto and has transfer intermediate chambers connected thereto, and the transfer intermediate chambers have subsequent vacuum transfer chambers connected thereto, and wherein the wafers are transferred via the lock chamber to the first vacuum transfer chamber to be processed in each of the subsequent vacuum processing chambers, which are further transferred via any of the transfer intermediate chambers connected to the first vacuum transfer chamber to the subsequent vacuum transfer chambers, and the respective wafers transferred to the subsequent vacuum transfer chambers other than the first vacuum transfer chamber are transferred to the respective vacuum processing chambers connected to each of the vacuum processing chambers and processed therein.

Description

technical field [0001] The present invention relates to a vacuum system provided with a transport mechanism for semiconductor substrates to be processed (hereinafter, including semiconductor wafers and substrate-shaped samples, etc., simply referred to as "wafers") between a vacuum processing chamber and a vacuum transfer chamber of a semiconductor processing apparatus. The composition of the processing system, and the vacuum processing method using the system. In particular, it relates to a configuration of a vacuum processing system and a vacuum processing method in which a plurality of vacuum processing chambers are arranged in series via a transfer mechanism in the plurality of vacuum transfer chambers. Background technique [0002] In such an apparatus, especially an apparatus that processes a processing object in a reduced-pressure apparatus, miniaturization and high precision of processing are sought, and improvement of processing efficiency of a processing object, th...

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Problems solved by technology

[0009] In the prior art that does not sufficiently consider the productivity per unit installation area, the wafer processing capacity per unit installation area of ​​the devices constituting the vacuum processing system is lost.

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