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Three-dimensional configuration providing electromagnetic interference shielding for electronics enclosure

A technology for electronic equipment and enclosures, applied in the fields of magnetic/electric field shielding, electrical components, digital processing power distribution, etc., can solve the problems of expensive, poor tolerance, etc., and achieve the effect of cheap shielding solutions

Inactive Publication Date: 2011-05-18
TORTURED PATH EMI SOLUTIONS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

They are poorly tolerated and very expensive
Furthermore, existing manufacturing techniques designed to address these issues required forming the housing so that it had to have tongue and groove joints or other prohibitive solutions

Method used

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  • Three-dimensional configuration providing electromagnetic interference shielding for electronics enclosure
  • Three-dimensional configuration providing electromagnetic interference shielding for electronics enclosure
  • Three-dimensional configuration providing electromagnetic interference shielding for electronics enclosure

Examples

Experimental program
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Embodiment Construction

[0089] use as Figure 5A and Figure 5B The "shell" or "scallop" embodiment of the invention shown, can be formed or otherwise configured in three dimensions such that they generally extend along the inner perimeter of the edge, and the two parts FSE and FL come together and satisfy the "sinusoidal ". All that is necessary to implement the 3D implementation of the invention is to "cut" or stamp the edges of the metal, and do the same cuts, and they come together in a "30 gap" or something like that. Advantages of the basic embodiment of the invention include, inter alia, the fact that no contacts are required and therefore do not deteriorate over time (see Figure 9B ). It is not necessary for the FSE and FL parts to make physical contact. Further advantages include the absence of tolerances and the absence of deformation.

[0090] See you again Figure 5A , showing a first embodiment of a three-dimensional EMI shielding solution for electronic device enclosures in side ...

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PUM

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Abstract

The invention provides a three-dimensional configuration providing electromagnetic interference shielding for an electronics enclosure. The configuration of the electronics enclosure comprises a computer chassis, in which three-dimensional shapes that may be in the form of a partial or quarter-sphere or cube or other periodic 'patterns' may be stamped, molded, cut or extruded into a lid and a five-sided 'box' to provide improved EMI shielding, such that the need for gaskets is reduced or eliminated.

Description

[0001] This application is a divisional application with an application date of January 10, 2006, an application number of 200680007823.0, and an invention titled Three-Dimensional Structure for Electromagnetic Interference Shielding for Electronic Device Shells. [0002] Priority Document Reference [0003] This application claims U.S. Patent Application Serial No. 11, filed November 10, 2005, and entitled "THREE-DIMENSIONAL CONFIGURATIONS PROVIDING ELECTROMAGNETIC INTERFERENCE SHIELDING FOR ELECTRONICS ENCLOSURES" 270,827, which is a continuation-in-part and claims the invention of Paul Douglas Cochrane, filed March 15, 2005, entitled "Reducing Costs and Liners and Other Priority under 35 USC § 120 of U.S. Application Serial No. 11 / 080,385 for "Reduced cost and gasketting "one-hit" and other manufacturing EMI-shielding solutions for computer enclosures" right. This application also claims Paul Douglas Cochraney's filed January 10, 2005 titled "Gasketless "one-hit" Electromag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00G06F1/18
Inventor 保罗·道格拉斯·科克拉内
Owner TORTURED PATH EMI SOLUTIONS