Concentric vias in electronic substrate

Abstract

A multiwall via structure in an electronic substrate having multiple conductive layers. The multiwall via structure includes an outer via coupled to a pair of the conductive layers, an inner via within the outer via and coupled to the same pair of conductive layers, and a dielectric layer between the inner and outer vias. In various embodiments, the pair of conductive layers can be inner conductive layers or outer conductive layers of the electronic substrate. In other embodiments, a method of preparing a multiwall via structure is provided.

Description

technical field [0001] The present invention relates generally to multilayer electronic substrates, and in particular to electronic substrates having multi-walled vias. Background technique [0002] Vias are plated holes that electrically couple conductive layers of a multilayer substrate, such as a multilayer printed circuit board substrate or a packaging substrate. Regular vias have a signal path that connects different conductive layers. In a densely packed design with many electrical signals, many connections between different conductive layers may be required, and the space occupied by vias and their associated capture pads may be sufficient to expand the overall size of the substrate. It would be desirable to increase electrical signal density without a concomitant increase in the space occupied by vias and their capture pads. Contents of the invention [0003] In one aspect, a multi-walled signal-carrying via (via) structure in an electronic substrate having multi...

AI Technical Summary

Problems solved by technology

In densely packed designs with many electrical signals, many connections between different conductive layers may be required, and the space occupied by vias and their associated capture pads may be sufficient to expand the overall size of the substrate

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