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Optical fiber type photoelectric composite board

A photoelectric composite board and fiber-optic technology, which is applied in the coupling of optical waveguide, light guide, optics, etc., can solve the problems of inability to integrate optical signals, increase the volume of optoelectronic equipment, and cannot further increase signal density, etc., to achieve manufacturability and The effects of maturing materials, increasing signal density, and reducing volume

Active Publication Date: 2021-04-09
CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]Aiming at the technical problems that the above-mentioned high-speed signals, radio frequency and optical signals cannot be integrated, it is necessary to bundle radio frequency lines and optical cables, so that the volume of optoelectronic equipment becomes larger and the signal density cannot be further improved , the purpose of the present invention is to provide a fiber-optic composite board to solve the above problems

Method used

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  • Optical fiber type photoelectric composite board
  • Optical fiber type photoelectric composite board
  • Optical fiber type photoelectric composite board

Examples

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Embodiment Construction

[0018] The present invention will be further described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0019] Such as Figure 1 to Figure 3 Shown is a specific embodiment of a fiber-optic composite board of the present invention, including a PCB board and an optical layer. The PCB board is divided into an upper PCB board 1 and a lower PCB board 2. In this embodiment, the upper PCB board is mechanically pressed The PCB board and the lower PCB board are integrated into a photoelectric composite board as a whole; the upper PCB board 1 and the lower PCB board 2 can be a radio frequency backplane with surface mount components on one side for transmitting radio frequency signals, and a high-speed backplane for transmitting high-speed signals The backplane or the high-speed radio frequency integrated board used to transmit radio frequency signals and high-speed signals, the upper PCB board 1 and the lower PCB board 2 are butt-bonded by doubl...

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Abstract

The invention relates to an optical fiber type photoelectric composite board comprising multiple layers of PCBs which are fixedly connected into a whole in a stacked mode, the PCB on the outer side is any one of a radio frequency backboard, a high-speed backboard and a high-speed radio frequency integrated board with surface-mounted components on the single side, and a cavity for containing and fixedly connecting an optical layer is reserved between the PCBs on the outer side so that optical signals can be transmitted conveniently. The optical layer comprises at least one substrate and an optical fiber fixed on the substrate to form a stable light channel. Compared with the prior art, radio frequency signals, high-speed signals and optical signals are transmitted in an integrated mode, the signal density is improved, the trouble of bundling and fixing radio frequency lines and optical cables is avoided, the size of photoelectric equipment is reduced, manufacturability and materials are relatively mature, and the optical fiber type photoelectric composite board can be quickly pushed to the market.

Description

technical field [0001] The invention relates to the technical field of integrated optoelectronics, in particular to an optical fiber type optoelectronic composite board. Background technique [0002] The existing common optoelectronic interconnection schemes generally use PCB boards for high-speed signals, and jumper wires for RF and optical signals. There are also separate RF backplanes or optical fiber flexible boards to transmit and process RF signals and optical signals respectively. There is no integrated optoelectronic composite board product that integrates the above three signals at the same time, so the radio frequency lines and optical cables need to be bundled and fixed, which increases the volume of the optoelectronic equipment and cannot further increase the signal density. Contents of the invention [0003] In view of the above-mentioned technical problems that high-speed signals, radio frequency, and optical signals cannot be integrated, which leads to the n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02G02B6/42
CPCH05K1/0274G02B6/428G02B6/424
Inventor 陈学永刘保卫朱国宜徐征郭建设黄澄王楠楠
Owner CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD