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Apparatus and method for measuring semiconductor

A technology for measuring devices and measuring methods, which is applied in the direction of measuring devices, single semiconductor device testing, measuring electricity, etc., and can solve problems such as inability to perform correct contact pins

Inactive Publication Date: 2011-05-25
PIONEER FA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, there is no problem when the chip position is correct with respect to the assumed chip position at the time of calibration, but there is a problem that correct contact cannot be performed when the chip position is shifted from the reference chip position.

Method used

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  • Apparatus and method for measuring semiconductor
  • Apparatus and method for measuring semiconductor
  • Apparatus and method for measuring semiconductor

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Experimental program
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Embodiment

[0063] Hereinafter, the most preferable mode for carrying out the present invention will be described with reference to the accompanying drawings.

[0064] (1) Basic structure example

[0065] First, refer to figure 1 An example of the basic configuration of a probe device, which is a specific example of the embodiment of the semiconductor measurement device of the present invention, will be described. here, figure 1 It is a schematic diagram showing an example of the basic configuration of the detection device of the present embodiment.

[0066] like figure 1 As shown, a basic configuration example of the probe device 1 includes a stage 100 , a stage position adjustment unit 110 , a first detector 200 , a second detector 300 , a control unit 400 , and a photodetector 410 . According to such a probe apparatus 1, the electrical characteristic of the chip 500 which is a specific example of the electronic component in this Example can be measured.

[0067] The table 100 is a s...

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PUM

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Abstract

Provided is an apparatus for measuring electrical characteristics of a plurality of electronic components at the same time. A semiconductor measuring apparatus (1) is provided with a placing means (100) whereupon a plurality of electronic components (500) are placed; a first moving means (110) which can move the placing means in parallel to a surface whereupon the electronic components are placed; a first probe (200) for measuring the characteristics by being brought into contact with one electronic component; a second probe (300) which measures the characteristics by being brought into contact with other electronic component; a second moving means (320) which can move the second probe in parallel to the surface whereupon the electronic components are placed; and a third moving means (110) which can move the placing means in a direction orthogonally intersecting with the surface whereupon the electronic components are placed. The first moving means moves the placing means so that the one electronic component faces the first probe. The second moving means moves the second probe so that the second probe faces other electronic component. The third moving means moves the placing meansso that the first and the second probes and the corresponding electronic components are broughtinto contact with each other.

Description

technical field [0001] The present invention relates to the technical field of semiconductor measurement devices and methods for measuring electrical characteristics by contacting probes with electronic components such as chips divided by a cutting process. Background technique [0002] Conventionally, in order to measure the electrical properties of each electronic component such as a plurality of semiconductor chips formed on a semiconductor wafer, a semiconductor measuring apparatus equipped with a probe is used to measure the electrical properties of the electronic component by performing a stylus with a probe. According to this measurement, semiconductor chips judged to have poor characteristics can be excluded before the mounting process, and as a result, cost reduction, productivity improvement, and the like can be achieved. [0003] Generally, a probe device is used in which a measurement site such as an electrode part provided on the chip can be connected to the pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R31/26
CPCG01R31/2887
Inventor 清水寿治藤森昭一青木秀宪
Owner PIONEER FA