Cover membrane for printed circuit board

A printed circuit board and cover film technology, applied in the direction of printed circuit components, etc., can solve the problems of poor tensile strength, dimensional stability, high cost of black polyimide film 21, non-compliance with requirements, etc., and achieve excellent resistance. The effect of folding performance

Active Publication Date: 2015-06-03
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Another well-known structure such as figure 2 As shown, a black polyimide film 21 added with carbon powder is used, and an adhesive layer 22 is formed on the black polyimide film 21. Although the polyimide protective film manufactured in this way has better However, the cost of the black polyimide film 21 is too high, and it does not meet the requirements in actual mass production, and the polyimide protective film containing additives also has the risk of deterioration in properties such as tensile strength and dimensional stability. consider

Method used

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  • Cover membrane for printed circuit board
  • Cover membrane for printed circuit board
  • Cover membrane for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0016] Embodiment: a kind of cover film for printed circuit board, such as image 3 As shown, it includes a core layer 32, a black composite material layer 33 with a low refractive index and an adhesive layer 31 for adhering the cover film to a printed circuit board, the core layer is fixedly sandwiched between the composite material layer and the between the adhesive layers.

[0017] In order for the covering film of this example to have the function of shielding the circuit pattern, the composite material layer includes a black substance. The cover film is composed of a mixture of resin, black substance and inorganic filler, wherein the resin is epoxy resin, the black substance is a mixture of one or more selected from black pigments, carbon powder or carbon nanotubes, and the inorganic filler is selected A mixture of one or more of titanium dioxide, boron nitride and barium sulfate. In order to maintain the folding resistance and scratch resistance of the composite materi...

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Abstract

The present invention discloses a cover membrane for a printed circuit board, comprising a center layer, a black composite material layer with a low refractive index, and an adhesive layer which is used to adhere the cover membrane to the printed circuit board. The center layer is fixedly clamped between the adhesive layer and the composite material layer, the composite material layer is formed by mixing resin, a black substance with an inorganic filling material and has low refractive index and black color, therefore, the cover membrane has misty characteristic on the outer surface thereof and is suitable for the printed circuit board in need of covering the circuit patterns. Besides, the cover membrane has excellent folding resistance, and is especially suitable for a flexible printed circuit board.

Description

technical field [0001] The utility invention relates to a cover film for a printed circuit board, in particular to a cover film with a low-gloss composite material layer, which can be applied to a printed circuit board with circuit shielding requirements. Background technique [0002] Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics grows, the demand for printed circuit boards is also increasing day by day. Due to the characteristics of flexibility and three-dimensional wiring, flexible printed circuit boards are currently widely used in computers and their peripheral equipment, Communication products and consumer electronics products, etc. [0003] Generally speaking, flexible printed circuit boards are mainly composed of copper foil substrate (FCCL) and cover film (CL). Generally, plastic film is used as cover film, or a thin layer of insulating ink is formed by screen printing technology as cover mem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02B32B27/20
Inventor 林志铭向首睿周文贤李建辉
Owner KUSN APLUS TEC CORP
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