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Electronic assembly and method for the production thereof

一种电子组件、组件的技术，应用在印刷电路制造、半导体/固态器件制造、电气元件等方向，能够解决高制造费用、高成本、高加工深度等问题

Inactive Publication Date: 2014-07-16
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this, on the one hand, it is disadvantageous to have relatively high production costs and high machining depths, which are each associated with very high costs
On the other hand, the possible large dimensions due to the given housing form are disadvantageous

Method used

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  • Electronic assembly and method for the production thereof

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Embodiment Construction

[0027]The drawing shows an electronic component 1 with two conductor substrates 2 , ie low temperature co-fired ceramics (LCTT) 3 , arranged approximately parallel to one another. Electronic modules 4 , such as semiconductors 5 , are arranged on the conductor substrate. These electronic modules are soldered or bonded to the conductor substrate 2 , for example by means of bonding wires 6 . In this case, the conductor substrates 2 are arranged plane-parallel and spaced apart from one another in such a way that connecting conductors 7 are arranged between them, which connecting conductors are formed, for example, at least partially in the form of a stamped grid 8 . This connecting conductor 7 has an elastic contact spring 9 for contacting the conductor substrate 2 , which is preferably formed in one piece with the connecting conductor 7 , for example by stamping and forming. Subject to the spacing of the conductor substrates 2 from one another, the contact springs 9 are biased a...

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PUM

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Abstract

An electronic assembly has at least one conductor substrate carrying components, which conductor substrate is surrounded by a mechanical protection. The conductor substrate is encased using a molding compound as a mechanical protection and is contacted by at least one intrinsically stiff, spring-elastic electrical connection conductor, the connection conductor being embedded in the molding compound, at least in sections.

Description

technical field [0001] The invention relates to an electronic component with at least one conductor substrate for supporting the component, which is surrounded by a mechanical protection. Furthermore, the invention relates to a method for the production of the electronic component. Background technique [0002] In order to protect the electronic components, the electronic components are enclosed in a housing. Especially in hybrid technology, the assembled and bonded substrate backing is mounted in a prefabricated housing by an expensive installation process, for which the usual sequence of steps is bonding the substrate to the base plate, mounting the housing , Bonding the substrate, laying the substrate, assembling the cover and installing the integrity of the shell. In this respect, on the one hand, the relatively high manufacturing effort and the high machining depth are disadvantageous, which are each associated with very high costs. On the other hand, the possible la...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28H05K1/14H01L23/433H01L23/495H05K3/36
CPCH01L23/49575H01L2924/09701H05K2201/1034H05K1/144H05K2201/10924H01L2224/48472H01L23/49861H01L23/4334H05K3/284H05K3/321H05K2203/1131H05K1/0306H05K2203/1316H01L23/49551H05K3/368H05K2201/10628H01L2224/48227H01L2924/181H01L21/565H01L23/3121H01L2924/00H01L2924/00012
Inventor W·勒特林施奥埃费U·格贝尔
Owner ROBERT BOSCH GMBH