Method for preparing trimmer

Abstract

The invention discloses a method for preparing a trimmer, which comprises: fixing the grinding ends of a plurality of abrasive particles on a lower die by adhesive, pouring liquid resin, allowing the liquid resin to solidify to fixedly combine with the plurality of abrasive particles and removing the adhesive adhered on the grinding ends. During the liquid resin pouring operation, the plurality of abrasive particles do not shift and have the same protruding height, and the grinding end face of the trimmer is flatter; and the resin combined with the plurality of abrasive particles, before solidification, is subjected to pressurization and vacuumizing to reduce the air bubble content of the resin and increase the holding force of the resin for the plurality of abrasive particles, so that the plurality of abrasive particles do not strip when trimming a grinding pad.

Description

technical field [0001] The present invention relates to implements for conditioning or conditioning chemical mechanical polishing (CMP) pads, and more particularly to methods of making conditioners. Background technique [0002] Chemical Mechanical Polishing (CMP) is a precision polishing process during wafer production, the purpose is to completely planarize the wafer surface so that the designed micro circuit pattern can be completely distributed on the wafer through the exposure and development process. During chemical mechanical polishing, the abrasive liquid is continuously added to the rotating polishing pad, and the polishing of the wafer surface is completed by means of the mechanical grinding of abrasive grains and the corrosion of chemical oxidants, so that the wafer surface is fully planarized. [0003] Polishing debris builds up on the surface of the polishing pad during the grinding process. The accumulation will cause the top of the polishing pad to be glazed ...

AI Technical Summary

Problems solved by technology

[0006] The sintered and brazed bond layer is used to fix the structure of diamond abrasive grains. Under the action of high temperature or the erosion of high temperature binder, diamond abrasive grains are easy to deteriorate and produce cracks; therefore, when diamond abrasive grains are used for polishing pads When trimming, it is easy to fall off or break

The method of fixing the diamond abrasive grains with the resin layer does not have the above situation, but the resin layer is prone to air bubbles. When the air bubbles contact the diamond abrasive grains, the holding force of the fixed diamond abrasive grains will be reduced; therefore, when the diamond abrasive grains are on the When the polishing pad is trimmed, it is easy to fall off or break

[0007] In the operation of sintering, brazing or resin-fixed diamond abrasive grains, the diamond abrasive grains are easy to move, and it is difficult to make multiple diamond abrasive grains have the same protruding height, so the flatness of the grinding end surface of the dresser is poor

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