Method and device for monitoring wafer transmission accuracy and bench using device

Abstract

The invention relates to method and device for monitoring wafer transmission accuracy and a bench using the device. The method comprises the following steps: 1, measuring and collecting a voltage signal on an etching bench terminal detecting circuit board; 2, comparing the value of the voltage signal with a preset value; and 3, alarming when the value of the voltage signal is lower than the preset value. The device comprises a signal collection module, a comparison module and an alarming module, wherein the signal collection module is used for measuring and collecting the voltage signal on the etching bench terminal detecting circuit board; the comparison module is connected with the signal collection module and used for comparing the value of the voltage signal measured by the signal collection module with the preset value; and the alarming module is connected with the comparison module and used for alarming when the value of the voltage signal is lower than the preset value. The risk of etching rate is reduced by determining whether a wafer is accurately transferred to a reaction chamber or not by comparing the value of the voltage signal on the terminal detecting circuit board with the preset value.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method, a device and a machine using the device for monitoring the accuracy of wafer delivery. Background technique [0002] At present, the design of etching machines all adopts stepping motor to drive the arm to move, and the wafer to be etched is passed into the reaction chamber from the wafer box, and placed on the chuck (such as figure 1 shown), when the accuracy of the transfer process becomes poor, the position of the wafer in the reaction chamber will be deviated. Experiments have proved that when the position of the wafer in the reaction chamber is skewed (as figure 2 As shown), the etching rate will be greatly reduced, and the etching will be insufficient, which will affect the product yield. Therefore, there is a need for a method and apparatus for monitoring the position of the wafer after it is transferred to the reaction chamber, ie, the transfer accur...

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Problems solved by technology

[0002] At present, the design of etching machines all adopts stepping motor to drive the arm to move, and the wafer to be etched is passed into the reaction chamber from the wafer box, and placed on the chuck (such as figure 1 shown), when the accuracy of the transfer process becomes poor, the position of the wafer in the reaction chamber will be deviated. Experiments have proved that when the position of the wafer in the reaction chamber is skewed (as figure 2 As shown), the etching rate will be greatly reduced, insufficient etching, etc., which will affect the product yield

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