Pressure-sensitive adhesive silicone composition
A technology of silicone and composition, applied in the direction of adhesives, etc., can solve problems such as unsatisfactory, limited application of silicone PSA composition, energy cost, etc.
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Embodiment 1
[0111] Example 1: Preparation of a pressure sensitive adhesive (PSA) composition according to the present invention
[0112] 500 g of MQ(OH) resin (A) and 255 g of toluene were introduced into the reactor, and then stirring was started at a speed of 110 rpm.
[0113] Organic silica gel (B) (255 g) was added in a small amount within 1 hour under stirring.
[0114] The heating bath worked, and when the temperature of the reaction mixture reached 113°C, 6.78 g of a dilute solution of the condensation catalyst was introduced. After stirring for 4 hours under reflux of toluene, the catalyst was neutralized by introducing 9.05 g of a dilute neutralization solution. After 20 minutes, the heating bath was removed and the mixture was allowed to cool. A cross-linkable base composition called CBR1 was obtained.
[0115] Extract 40.00g aliquote of the obtained basic composition CBR1, then still keep stirring and add 1.00g MD under cold conditions Vi Q(OH) resin (E), 0.63 g of 2,4-dichlorobenzoy...
Embodiment 2-6
[0117] Example 2-6: Preparation of pressure sensitive adhesive (PSA) composition according to the present invention
[0118] Follow the procedure of Example 1 but the basic composition CBR1, toluene, DCB peroxide and MD Vi The amount of Q(OH) resin (E) is shown in Table 1, expressed in g.
[0119] Table 1
[0120]
Embodiment 7
[0124] Example 7: Preparation of pressure sensitive adhesive (PSA) composition according to the present invention
[0125] 709.85 g of MQ(OH) resin (A) and 403.75 g of toluene were introduced into the reactor, and then stirring was started at a rate of 110 rpm.
[0126] Organic silica gel (B) (386.40 g) was added in a small amount under stirring within 1 hour. The temperature reached by self-heating is about 40-45°C. After the glue is completely dissolved, the base composition glue in the form of a homogeneous mixture is stored at ambient temperature. A crosslinkable base composition called CBR2 was obtained.
[0127] Then add 3.08g of MD to a 40.39g aliquot of the base composition CBR2 under stirring and under cold conditions Vi Q(OH) resin (E), 20.57g of peroxide DCB and 20.57g of toluene.
[0128] The obtained pressure-sensitive adhesive composition was packaged in a glass vial.
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Abstract
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