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Semiconductor wafer transfer and process pretreatment equipment

A semiconductor and preprocessing technology, applied in semiconductor/solid-state device manufacturing, conveyor objects, electrical components, etc., can solve the problems of low wafer yield, low robot efficiency, structural design defects, etc., to reduce the movement distance, avoid Cross-contamination, the effect of improving production efficiency

Active Publication Date: 2011-06-29
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

Most of the equipment manufacturers are due to structural design defects in this link, which affects the subsequent wafer output rate and yield rate
At present, the lack of the internal layout of most manufacturers' equipment and the functions of related components make the efficiency of the manipulator low, and the lack of functions of related components affects the constant and suitable environment of the internal environment of the equipment, resulting in low yield of wafers.

Method used

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  • Semiconductor wafer transfer and process pretreatment equipment
  • Semiconductor wafer transfer and process pretreatment equipment
  • Semiconductor wafer transfer and process pretreatment equipment

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Embodiment Construction

[0026] The semiconductor wafer transfer and pre-process pretreatment equipment proposed by the present invention are described as follows in conjunction with the accompanying drawings and embodiments.

[0027] like Figure 1-3 As shown, the semiconductor wafer transfer and pre-process pretreatment equipment according to an embodiment of the present invention is supported by the equipment skeleton 101, which is in the shape of a rectangular parallelepiped cabinet, including:

[0028] Wafer storage box 103 is arranged on the front side of the equipment cabinet ( figure 1 The front shown) is used to carry semiconductor wafers; the wafer loading port 102 is arranged under the wafer storage box 103 and is used to carry the wafer storage box 103; the manipulator 203 is arranged inside the equipment for The input and output storage device 201 and the wafer correction device 202 on the back of the equipment grab the processed semiconductor wafers, place them on the wafer storage box ...

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Abstract

The invention discloses semiconductor wafer transfer and process pretreatment equipment, which comprises a wafer storage box (103), a mechanical hand (203) and a wafer correction device (202), wherein the wafer storage box (103) is arranged on the front of the equipment, is arranged on a wafer loading port (102) and is used for bearing a semiconductor wafer; the mechanical hand (203) is arranged inside the equipment and is used for grabbing the semiconductor wafer from an input / output storage device (201) and the wafer correction device (202), which are arranged on the back of the equipment; the mechanical hand (203) is arranged on the wafer storage box (103), grabs the semiconductor wafer from the wafer storage box (103), and is arranged on the input / output storage device (201) or the wafer correction device (202); the mechanical hand (203) can horizontally rotate and also can shift in the horizontal or vertical direction along a mechanical hand guide rail (204); and the wafer correction device (202) is arranged under the input / output storage device (201) and is used for adjusting a nick position of the semiconductor wafer which is arranged on the input / output storage device (201). The equipment can improve the wafer throughput and qualification rate.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer manufacturing, in particular to semiconductor wafer delivery and pre-processing equipment. Background technique [0002] At present, all semiconductor equipment in the world needs the function of semiconductor wafer transfer and pre-process pretreatment. Most of the equipment manufacturers are due to structural design defects in this link, which affects the subsequent wafer output rate and yield rate. At present, the lack of the internal layout of most manufacturers' equipment and the functions of related components make the efficiency of the manipulator low, and the lack of functions of related components affects the constant and suitable environment of the internal environment of the equipment, resulting in a low yield of wafers. Contents of the invention [0003] (1) Technical problems to be solved [0004] The technical problem to be solved by the present invention is to provid...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/677
Inventor 赵宏宇王锐廷张晓红
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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