Radiating method of LED (light-emitting diode) light source module

Abstract

The invention relates to a semiconductor illumination technology, and in particular relates to a radiating method of an LED (light-emitting diode) light source module. The LED light source module comprises a metal substrate; an LED lamp bulb is arranged in front of the metal substrate; the LED lamp bulb is connected with the metal substrate by a base; the LED light source module also comprises a lens; the light incident side of the lens is provided with a concave pit formed by defining of a skirt edge; the lens is arranged on the LED lamp bulb and the base in a buckled manner; the LED lamp bulb and the base are sunk into the concave pit; the skirt edge wraps the base; the LED light source module further comprises a section bar which is provided with a cavity body; the top surface of the section bar is provided with a hole; the metal substrate is arranged in the cavity body, and the lens protrudes out of the top surface of the section bar through the hole; and the section bar is provided with one top surface and two side walls. The heat transferring path of the radiating method is as follows: LED lamp bulb-base-metal substrate-top surface of the section bar-side walls of the section bar. The invention provides the radiating method of an LED light source module, which is high in radiating efficiency.

Description

technical field [0001] The invention relates to semiconductor lighting technology, in particular to a heat dissipation method for an LED light source module. Background technique [0002] Semiconductor lighting technology has become the mainstream of the light source market because of its energy saving and long service life. [0003] LED light source modules basically include a metal substrate to enhance the heat conduction effect. The LED luminous body is arranged on the front surface of the metal substrate, and the heat dissipation component is pasted on the back surface of the metal substrate. Its heat transfer path needs to completely pass through the metal substrate. [0004] For example, the Chinese patent document CN101625081A discloses an LED light source module on January 13, 2010. The LED light source module includes an LED light emitting module and a module base. The LED light source module also includes an optical cover plate, and the optical cover plate It is...

AI Technical Summary

Problems solved by technology

[0006] The heat transfer path of the prior art also determines the limitations of its heat dissipation effect. Like the aforementioned patent documents, in the prior art, the heat generated by the LED when it is working is transferred from the front of the metal substrate to the metal substrate, and then from the metal substrate. The opposite side is transferred to the heat dissipation component, and the lengthy heat transfer path determines the low heat dissipation efficiency

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