Unlock instant, AI-driven research and patent intelligence for your innovation.

Testing method for testing bending capability of semi-finished product IC of LCM module and IC bending jig

A capability testing, semi-finished product technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve the problem of no post-IC bending resistance test method, etc., to avoid quality problems and improve quality.

Active Publication Date: 2012-11-21
CPT TECH GRP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no test method for the bending resistance of the IC after forming the semi-finished product of the LCM module

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Testing method for testing bending capability of semi-finished product IC of LCM module and IC bending jig
  • Testing method for testing bending capability of semi-finished product IC of LCM module and IC bending jig
  • Testing method for testing bending capability of semi-finished product IC of LCM module and IC bending jig

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

[0014] The method for testing the bending capacity of an LCM module semi-finished product IC of the present invention, the LCM module semi-finished product includes a liquid crystal panel, an IC and a PWB, and is characterized in that the test method is as follows:

[0015] (1) Among the LCM module semi-finished products with different types or ICs produced by different manufacturers, select the LCM module semi-finished products with intact IC pins and no electrical defects as the samples to be tested, and select 3 pieces for each model. What should be explained here is that the semi-finished product of the LCM module is an assembly of liquid crystal panel, IC and PWB. Place it under the electron microscope MM-60 to observe the condition of the pins at the junc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a testing method for testing bending capability of a semi-finished product IC of LCM module and an IC bending jig. The testing method comprises the steps of sequentially fixing the liquid crystal panels of the samples to be tested on a fixed base respectively; swinging the upper end part of a PWB for a plurality of times in a reciprocating way; subsequently detecting whether an IC pin of the LCM semi-finished product is complete or has electrical badness; recording the data; by testing the IC bending capability of the LCM semi-finished products, comparing the difference between the anti-bending capability among IC of different manufacturers and types, thus producing the IC product pin with strong anti-bending capability, thereby improving the LCM quality. Furthermore, the IC bending jig has simple structure and low manufacturing cost and can be operated conveniently.

Description

technical field [0001] The invention relates to a method for testing the bending capacity of an LCM module semi-finished product IC and an IC bending fixture. Background technique [0002] During the mechanical vibration reliability test of the LCM module, IC pins are prone to defects such as bending and pulling, resulting in bright lines. Therefore, in the stage of introducing new products or new types of ICs, it is necessary to conduct pin inspections on the selected ICs. The bending resistance test compares the differences in the bending resistance of ICs produced by different manufacturers, so as to select ICs with relatively strong bending capacity for LCM assembly production. At present, there is no test method for the bending resistance of the IC after forming the semi-finished product of the LCM module. Contents of the invention [0003] The invention introduces a method for testing the bending ability of LCM semi-finished products IC and IC bending fixtures, whic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/02
Inventor 游敬春林金灵
Owner CPT TECH GRP