White LED (Light-Emitting Diode) encapsulation structure capable of improving illumination efficiency and manufacture method thereof
A technology of white light emission and luminous efficiency, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems that the luminous efficiency of the packaged light-emitting chip 2 cannot be effectively increased, and achieve the effect of improving luminous efficiency
Inactive Publication Date: 2011-07-27
HARVATEK CORPORATION
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Problems solved by technology
[0003] However, although "isolating the fluorescent colloid 5 from the packaged light-emitting chip 2" can make the fluorescent colloid 5 maintain its original quality, the above-mentioned method cannot effectively increase the number of the packaged light-emitting chip 2. luminous efficiency
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[0051] see figure 2 As shown, the present invention provides a method for manufacturing a white light-emitting diode packaging structure that can increase luminous efficiency, which includes the following steps: First, a semiconductor light-emitting unit is provided, which has a light-emitting body and a positive electrode formed on the light-emitting body Conductive layer and a negative electrode conductive layer formed on the light-emitting body; then, forming a light-transmitting layer on the semiconductor light-emitting unit; then, forming at least two gaps penetrating the light-transmitting layer for exposing the positive electrode A part of the upper surface of the conductive layer and a part of the upper surface of the negative electrode conductive layer; next, the semiconductor light-emitting unit is electrically arranged on a substrate unit; then, the above-mentioned at least two wires pass through the above-mentioned two gaps respectively, so as to respectively elec...
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The invention relates to a white LED (Light-Emitting Diode) encapsulation structure comprising a substrate unit, a semiconductor light-emitting unit, a light-transmitting unit, a conductive unit and a fluorescent unit. The semiconductor light-emitting unit is formed on the substrate unit and provided with a light-emitting body, a positive conductive layer and a negative conductive layer, the positive conductive layer and the negative conductive layer are formed on the light-emitting body; the light-transmitting unit is provided with a light-transmitting layer and at least two notches, the light-transmitting layer is formed on the semiconductor light-emitting unit, the at least two notches are used for exposing partial upper surface of the positive conductive layer and partial upper surface of the negative conductive layer; the conductive unit is provided with two leads which respectively penetrate through the two notches so as to be respectively and electrically connected between the positive conductive layer and the substrate unit and electrically connected between the negative conductive layer and the substrate unit; and the fluorescent unit is formed on the substrate unit to cover the semiconductor light-emitting unit, the light-transmitting unit, and the conductive unit. The technical scheme provided by the invention can effectively improve the illumination efficiency of the encapsulated illumination chip.
Description
technical field [0001] The invention relates to a packaging structure of a light emitting diode and a manufacturing method thereof, in particular to a packaging structure of a white light emitting diode capable of increasing luminous efficiency and a manufacturing method thereof. Background technique [0002] Please refer to the first figure, the conventional package structure of white LED includes: a package body 1, a packaged light-emitting chip 2, at least two conductive substrates (30, 31), a transparent colloid 4 and a fluorescent colloid 5. Wherein, the package body 1 has an accommodating space 10 . The above-mentioned at least two conductive substrates 30 , 31 are disposed in the accommodating space 10 of the package body 1 . The packaged light-emitting chip 2 is fixed in the accommodating space 10 of the package body 1 and electrically connected between the at least two conductive substrates 30 , 31 . The transparent colloid 4 is filled in the accommodating space 1...
Claims
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IPC IPC(8): H01L33/48H01L33/50H01L33/58
Inventor 汪秉龙庄峰辉萧松益
Owner HARVATEK CORPORATION