Guide wheel outline acquisition device

Abstract

The invention discloses a guide wheel outline acquisition device, which comprises a horizontal support, a magnetic V-shaped frame which is fixed with the wheel shaft at the two ends of a guide wheel and arranged at the two ends of the horizontal support, a vertical support arranged on the horizontal support through an adjustable connecting device, and an industrial camera which can be arranged onthe vertical support in a sliding manner. The guide wheel outline acquisition device provided by the invention detects the outline of the guide wheel by means of visual detection and adopts a high-resolution industrial camera to take a photo of the surface of the guide wheel. In the invention, the device can be fixed on the wheel shaft at the two ends of the guide wheel by the magnetic V-shaped frame to directly detect the guide wheel on an extracting machine and a slicing machine without taking the guide wheel out, so the unnecessary loss caused by loss is reduced greatly. In addition, the adjustable connecting device can adjust the vertical upright post left and right along the horizontal upright post, so as to detect different positions in the axial direction of the guide wheel.

Description

technical field [0001] The invention relates to the technical field of guide wheel surface profile detection, and more specifically, to a guide wheel profile acquisition device. Background technique [0002] Both the squarer for cutting silicon blocks and the slicer for cutting silicon wafers are provided with guide wheels. The surface of each guide wheel is covered with V-shaped grooves, which are mainly used to fix steel wires to cut silicon blocks or wafers. Due to the friction between the steel wire and the guide wheel during the operation of the machine, over time, the V-shaped groove of the guide wheel will be damaged by the steel wire, resulting in the inability to accurately fix the steel wire. [0003] At present, the contour detection of the guide wheel mainly uses the Marr contour instrument, which is completed by virtualization after the probe points. The Marr profiler is large in size, and the probe is dirty, which greatly affects the measurement accuracy, so ...

AI Technical Summary

Problems solved by technology

The Marr profiler is large in size, and the probe is dirty, which greatly affects the measurement accuracy, so it can only roughly measure the profile of the surface of the guide wheel, and cannot directly observe the groove shape, and cannot accurately give the profile map and Dimensions, not to mention the actual situation of the V-shaped groove loss of the guide wheel

And in the actual inspection, it is necessary to take out the guide wheel for inspection. Since it takes several hours to take out the guide wheel and reinstall it, this inspection method greatly delays the production progress

[0004] With the development of the photovoltaic industry, the production schedule of silicon wafers is getting tighter and tighter. The guide wheel is the necessary equipment for cutting silicon wafers. If the groove on the surface of the guide wheel is damaged but cannot be processed in a timely and accurate manner, it will definitely Affect the quality and progress of silicon wafer dicing, resulting in additional money loss

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