Device processor
A processor and device technology, which is applied in the direction of instrumentation, single semiconductor device testing, semiconductor/solid-state device manufacturing, etc., can solve the problems of limited time for loading wafers into waffle modules, inability to perform device loading, etc., and achieve rapid loading input, reduce the effect of alternate time
Inactive Publication Date: 2011-08-03
JT
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Problems solved by technology
[0011] However, loading of devices cannot be performed during the alternation with empty waffle packs, and therefore additional time for the waffle packs to be alternated is required, thereby reducing the time for loading wafers into the waffle packs. limit
Method used
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[0033] Hereinafter, the device processor of the present invention will be described in detail with reference to the drawings.
[0034] figure 1 It is a structural schematic diagram of the device processor of the present invention; Figure 2a and Figure 2b Perspective and cross-sectional views illustrating the structure of each slice; image 3 for figure 1 A three-dimensional schematic diagram of the waffle component of the device processor; Figure 4 as shown in figure 1 Conceptual diagram of the moving process of the device from the slice loading part to the device unloading part in ; Figure 5a to Figure 5c It is a schematic plan view of the working process of the wafer loading part; Figure 6a to Figure 6d It is a schematic plan view of the working process of the device unloading part; Figure 7a to Figure 7d It is a schematic diagram of the working process of the loading part of the waffle pack and the unloading part of the waffle pack; Figure 8 It is a structura...
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The invention relates to a device processor, and especially relates to a device processor for loading an eligible device into a wafer assembly in a device in a wafer state according to a detected result. The invention discloses a device processor which comprises a slice loading part for loading a slice loaded with the devices; a slice moving stage for receiving the slice from the slice loading part and moving the slice loaded with the devices; a picking-up tool for picking up eligible devices from the slice on the slice moving stage; and a device unloading part which comprises a first wafer assembly transporting part for moving a first wafer assembly and performing unloading, wherein the first wafer assembly is equipped with devices picked up by the picking-up tool, and a second wafer assembly transporting part which is linked with the first wafer assembly transported by the first wafer assembly transporting part and is used for moving the second wafer assembly and performing unloading, wherein the second wafer assembly is equipped with devices picked up by the picking-up tool.
Description
technical field [0001] The invention relates to a device handler (device handler), in particular to a device handler for loading qualified devices into waffle components among devices in a wafer state according to inspection results. Background technique [0002] A device (semiconductor chip) refers to an integrated circuit composed of a semiconductor whose conductivity is higher than that of non-conductors and lower than that of metal-like conductors. Chips originally refer to thin slices, but are now used to refer to semiconductor circuits. [0003] The device is formed by integrating various devices such as transistors, resistors and capacitors on a thin silicon wafer (silicon wafer) with a width and height of about 1 cm. [0004] Devices, as the basic components of modern computers, are the core of computing, storing data, controlling other chips and other functions, and are an important support for the electronics industry. [0005] The devices mentioned above all have...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/67H01L21/677G01R31/26H01L21/66
CPCG01R31/2867G01R31/2887G01R31/2893H01L21/67763H01L21/683
Inventor 柳弘俊尹芸重
Owner JT