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Lead frame and chip packaging body

A technology of chip packaging and lead frame, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of cost increase and achieve the effect of cost reduction

Active Publication Date: 2011-08-17
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the wire bonding position on the chip and the chip setting method usually have many changes in order to meet the use requirements, and the chip also has various sizes, so different types of lead frames must be used, thus causing the problem of increased cost

Method used

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  • Lead frame and chip packaging body
  • Lead frame and chip packaging body
  • Lead frame and chip packaging body

Examples

Experimental program
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Embodiment Construction

[0060] Figure 1A It is a schematic top view of a lead frame according to an embodiment of the present invention. Figure 1B for along Figure 1A The cross-sectional schematic diagram of the lead frame shown in the I-I' section in . Please also refer to Figure 1A and Figure 1B, the lead frame 10 includes a frame 100 , a die holder 102 , a connecting rod 104 and a pin 106 . The chip holder 102 is disposed in the package area 100 a surrounded by the frame 100 . In the present embodiment, the chip holder 102 includes two side-by-side carrying bars 102a. Both ends of the two carrying bars 102a are connected to form connecting portions 102b respectively. The connecting portion 102b can be in various shapes depending on actual needs, and is not limited to Figure 1A The shape shown in . The connecting rods 104 are connected between the frame 100 and the corresponding connecting portions 102 b to fix the relative position between the die holder 102 and the frame 100 . The conn...

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PUM

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Abstract

The invention discloses a lead frame and a chip packaging body. The lead frame comprises a framework, a chip carrier, a plurality of connecting rods and a plurality of pins. The chip carrier is configured in a packaging region surrounded by the framework. The chip carrier is provided with an open groove. The open groove extends along the length direction of the chip carrier, and the width of the open groove is less than or equal to one third of the width of the chip carrier. The connecting rods are connected for connecting the chip carrier with the framework. The pins are positioned in the packaging region and configured at the periphery of the chip carrier, and one end of each pin is connected with the framework.

Description

technical field [0001] The invention relates to a packaging component, and in particular to a lead frame and a chip package. Background technique [0002] Generally speaking, the production of integrated circuits is mainly divided into three stages: the manufacture of silicon chips, the fabrication of integrated circuits and the packaging of integrated circuits. In integrated circuit packaging, a lead frame is the medium that provides the electrical connection between the chip and the printed circuit board. [0003] The lead frame includes a frame, a die pad, a plurality of tie bars and a plurality of leads. The connecting rod is connected between the frame and the chip holder to fix the relative position between the chip holder and the frame. After the chip is placed on the chip holder and the chip is electrically connected to the pins through the wire bonding process, the sealing material is usually molded on the lead frame to cover the chip, the chip holder, The portio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
CPCH01L2224/32245H01L2224/48091H01L2224/73215H01L2224/73265H01L2224/48247H01L2224/32145H01L2224/48465H01L2224/4826H01L2924/00014H01L2924/00
Inventor 徐志宏谢玫璘徐义程许月珍
Owner ADVANCED SEMICON ENG INC
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