Printed circuit board copper-coating method and copper-coated printed circuit board

Abstract

The embodiment of the invention discloses a printed circuit board copper-coating method and a copper-coated printed circuit board. The method comprises the steps of: setting a region on a printed circuit board provided with a ball grid array (BGA) packaged component as a copper-coated prohibited area; and coating copper on regions on the printed circuit board except the copper-coated prohibited area. By implementing the printed circuit board copper-coating method and the copper-coated printed circuit board provided by the invention, in a copper-coating process of the PCB (Printed Circuit Board), the copper-coated prohibited area is set in a welding region of the BGA packaged component so that a copper skin is laid below the BGA packaged component. In a reflow welding process, deformation degree brought to a BGA welding surface of the PCB due to heating expansion is reduced, therefore, reject rate of the welding assembly of the BGA packaged component in the reflow welding process is reduced and manufacture cost is lowered.

Description

technical field [0001] The invention relates to integrated circuit packaging, in particular to a copper-clad printed circuit board method and a copper-clad printed circuit board. Background technique [0002] With the development of electronic technology, electronic products require smaller, faster and more powerful components. As soon as BGA (Ball Grid Array) packaging technology appeared, it became the best choice for high-density, high-performance, multi-pin packaging such as CPU, south / north bridge chip on the motherboard. [0003] BGA packaging technology is to make the pins into balls and arrange them in a grid-like pattern at the bottom of the packaged components. Components packaged with BGA technology can increase the memory capacity by two to three times while maintaining the same volume. BGA packaging technology has greatly improved the storage capacity per square inch. Under the same capacity, the volume of memory products using BGA packaging technology is only...

AI Technical Summary

Problems solved by technology

It can solve the problem that the soldering surface of the PCB is uneven due to the difference in thermal expansion coefficient between the PCB insulation material and the copper skin during the reflow soldering process, resulting in virtual soldering and disconnection or even solder joints falling off.

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