Aqueous cutting fluid for use with diamond wiresaw
A cutting fluid and wire saw technology, applied in the field of water-containing cutting fluid, water-containing cutting fluid for brittle materials), can solve the problems of frequent replacement of cutting fluid, nozzle blockage, etc., to achieve good cooling efficiency, easy removal, good chip suspension and dispersion effect
Inactive Publication Date: 2011-08-17
DOW GLOBAL TECH LLC
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[0089] Chemicals and Instruments
[0090] The cutting fluid of the present invention is prepared from the components described in Table 1, and its composition is recorded in Table 2. The cutting fluids of the comparative examples are all commercially obtained. None of the cutting fluids of the comparative examples included PAG-g-polycarboxylate.
[0091] Table 1
[0092] Components and Equipment
[0093]
[0094] Table 2
[0095] The composition of cutting fluid of the present invention
[0096] components
[0097] PEG-g-polycarboxylate
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Water-based cutting fluids for use with diamond wiresaws that are used for cutting or otherwise treating hard brittle materials, e.g., silicon ingots, comprise: A. Water-soluble, polymeric dispersing agent, typically a polycarboxylate; B. Optionally wetting agent; C. Optionally defoamer; D. Optionally corrosion inhibitor; E. Optionally chelant; F. Optionally biocide; and G. Water. Typically water comprises at least 50 weight percent of the fluid, and the polycarboxylate is grafted with a polyalkylene glycol, e.g., polyethylene glycol.
Description
field of invention [0001] The present invention relates to cutting fluids. In one aspect, the invention relates to aqueous cutting fluids and in another aspect, the invention relates to aqueous cutting fluids for use with diamond wiresaws. In yet another aspect of the present invention, the present invention relates to aqueous cutting fluids comprising polycarboxylates grafted with polyalkylene glycols (PAG), and in another aspect, the present invention relates to the use of aqueous cutting fluids Methods of handling brittle materials such as silicon ingots. Background of the invention [0002] Wire saws and similar equipment are used to cut hard, brittle materials such as silicon ingots to produce wafers and other slices for use in various industries such as the semiconductor industry. To effectively cut these brittle materials, wire saws are used in combination with cutting fluids. These fluids are slurry based, i.e. they include a combination of a suspending fluid and ...
Claims
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IPC IPC(8): C10M173/00C10M145/22
CPCC10N2240/401C10M2215/04C10N2230/04C10N2230/18C10M173/02C10M2227/061C10M2215/042C10M2209/086C10M2229/02C10M2209/084C10M2215/223C10N2230/24C10M2219/068C10M2201/06C10M2215/222C10M2209/104C10M2215/225C10M2215/14C10N2030/04C10N2030/18C10N2030/24C10N2040/22C10M2209/109C10M2209/108
Inventor 朱一平于汪林亨利.H.陈理查德.阎李芳
Owner DOW GLOBAL TECH LLC
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