Polishing head

A polishing head and diaphragm technology, applied in the field of polishing head, can solve the problems of cost increase, achieve long service life, consistent polishing effect, and reduce polishing cost

Active Publication Date: 2011-09-07
HWATSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, on the one hand, this cannot solve the danger of wafer throwing out and the impact on uniformity during the lifetime, and on the other hand, it will also cause an increase in cost.

Method used

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Embodiment Construction

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0023] In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or elem...

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PUM

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Abstract

The invention discloses a polishing head comprising a cover plate, a main diaphragm, a substrate, a flexible membrane and a retaining ring, wherein the main diaphragm is annular, has elasticity and is fixed on the lower surface of the cover plate; the substrate is fixed on the lower surface of the main diaphragm; the flexible membrane is fixed on the lower surface of the substrate, and the flexible membrane and the substrate limit a lower cavity communicated with the outside; the retaining ring is fixed on the lower surface of the substrate; and the area of the radial cross section of the retaining ring is gradually decreased from bottom to top. According to the polishing head of the embodiment disclosed by the invention, a wafer can be prevented from throwing in the chemical mechanical polishing process, and even and consistent effect can be obtained. In addition, the abrasion of the retaining ring can not lower polishing effect, and thus the retaining ring has longer service life soas to lower polishing cost.

Description

technical field [0001] The invention relates to a polishing head. Background technique [0002] In the manufacturing process of integrated circuits, as the feature size shrinks and the number of metal interconnection layers increases, the requirements for the flatness of the wafer surface are getting higher and higher. Chemical mechanical polishing is currently the most effective global planarization technology. Chemical mechanical polishing is to hold the wafer by the rotating polishing head and press it on the rotating polishing pad with a certain pressure. The polishing liquid composed of abrasive grains and chemical solution flows between the wafer and the polishing pad. The surface is planarized by a combination of chemical and mechanical action. The polishing head, which holds the wafer and applies pressure to its backside, is the key to planarizing the surface. [0003] In the actual chemical mechanical polishing process, the retaining ring of the polishing head is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B39/06
Inventor 路新春王同庆何永勇雒建斌
Owner HWATSING TECH
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