18results about How to "Uniform polishing effect" patented technology

The invention belongs to the technical field of aviation equipment maintenance, and particularly relates to aviation equipment maintenance polishing equipment which comprises a bottom plate, four groups of supporting columns and a top plate, an adaptive force supporting mechanism is fixedly mounted on the bottom plate, the four groups of supporting columns are fixedly mounted at four corners of the bottom plate respectively, and the top plate is fixedly mounted on the supporting columns. A hydraulic cylinder is fixedly installed on the top plate, the output end of the hydraulic cylinder penetrates through the top plate, a radian-adjustable polishing mechanism is connected to the lower portion of the output end of the hydraulic cylinder, and the radian-adjustable polishing mechanism comprises a lifting plate, a side plate, a polishing abrasive belt assembly, a leveraging pushing assembly and a bidirectional driving assembly. The multiple sets of polishing abrasive belts can move to change the polishing positions during polishing, the problem that polishing dead corners exist in gaps between the multiple sets of polishing abrasive belts is effectively solved, meanwhile, the polishing abrasive belts in the opposite direction conduct rotating polishing, and the situation that the polishing effect and quality are affected due to displacement caused by the polishing acting force is effectively avoided.

The utility model discloses a clamp for plasma polishing, which comprises a clamping seat, a main clamping rod, a distribution disc, a plurality of branch clamping rods and a clamping device, and the clamping seat, the main clamping rod, the distribution disc, the branch clamping rods and the clamping device are all made of metal plates. One end of the clamping base is provided with a connecting end used for being connected with the positive electrode of a power source, the distribution disc is provided with a plurality of evenly-distributed distribution holes, the two opposite ends of the branch clamping rod are provided with an upper through groove and a lower through groove, the number of the clamping devices is at least two, and the clamping devices are fixedly installed on the upper through groove and the lower through groove respectively so as to be used for clamping and fixing a metal tree in a matched mode. The clamp is connected with the positive electrode of the power supply through the clamping seat, and then current is uniformly guided to the metal tree through the main clamping rod, the distribution disc, the branch clamping rods, the clamping devices and other structures, so that the polishing uniformity of all parts of the metal tree is improved, and the uniform and consistent polishing effect can be achieved.

The utility model discloses a channel steel surface polishing treatment structure, which particularly relates to the technical field of metal processing and comprises a bottom plate, two first supports fixedly connected to the bottom of the bottom plate, a plurality of auxiliary wheels fixedly connected to the upper surface of the bottom plate, an outer cover fixedly connected to the top of the bottom plate, and two first rotating rods rotationally connected to the top of the outer cover. One end of the first rotating rod is fixedly connected with a rotating handle, two threads are formed in the outer side of the first rotating rod, and a polishing mechanism is slidably connected to the outer side of the outer cover. The polishing mechanism comprises two connecting plates, and the outer sides of the connecting plates are slidably connected with the inner side of the outer cover. The outer sides of channel steel of different models are ground through opposite movement, clamping and transmission of the two lower transmission discs, the upper transmission disc and the grinding roller, meanwhile, the multiple liftable grinding discs are attached to the inner sides of the channel steel for synchronous grinding, and the grinding efficiency and uniformity are improved; and in combination with the multi-point dust collection design, dust in the outer cover is rapidly collected through the conveying pipe, local accumulation is avoided, and the good polishing effect is kept.

The utility model discloses a knife tool module is changed with chopping board polishing, relates to chopping board polishing technical field, include: the frame, be located the assembly component of frame top, and the switching tool of staggered and symmetrically installed opposite of frame, the switching tool includes two pivot, two the opposite end of pivot fixed with two cross installation frame of staggered distribution, two cross installation frame through the opposite end rotation of a plurality of groups of pin shaft and a plurality of polishing module one -one assembly. The utility model discloses through always with horizontal state switching position's a plurality of polishing module, collocation different kinds of polishing mould, can realize the different polishing requirement of chopping board or the polishing of different kinds chopping board, and polishing mould operating end always faces down and horizontally, not only can ensure that polishing effect is uniform, surface quality is high, secondly reduces the time of adjustment and rework, guarantees the fluency of polishing, improves polishing efficiency.

The utility model discloses a single-wheel polishing device which comprises a jig assembly, a first driving piece, a second driving piece, a polishing assembly and a supporting assembly, the first driving piece is connected with the jig assembly to drive the jig assembly to reciprocate in the X-axis direction, and the polishing assembly is located above the jig assembly; the polishing assembly comprises a polishing wheel and a plurality of polishing pads, the second driving part is connected with the supporting assembly, and an output shaft of the second driving part is connected with the polishing wheel so as to drive the polishing wheel to rotate. The multiple polishing pads are arranged on the side, away from the second driving piece, of the polishing wheel at intervals around the axis of the polishing wheel, and a chip groove is defined between every two adjacent polishing pads. The first driving part 3 enables the jig assembly 2 to do reciprocating rectilinear motion in the X-axis direction (the horizontal direction), high feeding motion is achieved, and the surface of a workpiece is helped to obtain a more uniform polishing effect.

The utility model relates to the technical field of pearl powder ball production equipment, and provides a pearl powder ball production granulation polishing machine capable of automatically screening out polishing powder, which comprises a polishing box, the top end of the polishing box is fixedly connected with a mounting table, the top end of the inner wall of the mounting table is fixedly connected with a mounting plate, and the top end of the mounting plate is fixedly connected with a motor I; the driving end of the first motor is fixedly connected with a transmission rod, and the outer side of the transmission rod is fixedly connected with first stirring rods which are evenly distributed. According to the stirring device, the first motor drives the transmission rod, the first stirring rod and the first inner rack disc to synchronously operate, the first inner rack disc drives the second inner rack disc to oppositely rotate through transmission of the first gear and the second gear in the operation process, and the sleeving rod and the L-shaped connecting rod are further driven to synchronously operate; and the second stirring rod and the first stirring rod operate oppositely, the uniform polishing effect on the pearl tapioca pearls is achieved, and then the pearl tapioca pearls in the polishing cavity rub one another to be polished.

The utility model provides an XPS special-shaped extruded sheet edging device which comprises an edging device body, the edging device body comprises a bottom plate, an edging frame, a hoisting mechanism and a clamp, the edging frame is fixedly installed at the two ends of the surface of the bottom plate, an edging roller is installed in the middle of the bottom plate, the hoisting mechanism is installed at the top of the edging frame, and the clamp is installed on the bottom plate. A lifting rope is connected in the lifting mechanism, the bottom of the lifting rope is connected with the top end of a clamp, and the clamp comprises two parallel clamping plates. According to the edge grinding device, the special-shaped extruded sheet is moved in the vertical state, the bottom edge grinding process is completed in the moving process, the grinding efficiency is improved, labor is saved in the moving process, convenience is achieved, and high stability is achieved. When any position of the bottom of the special-shaped extruded sheet is polished, the pressure between the special-shaped extruded sheet and the edge polishing roller is always kept constant, so that the polishing effect of any position can be kept uniform, the edge polishing pressure is flexible and controllable, and the adjusting process is simple and convenient.

The invention is applied to the technical field of semiconductor processing, and discloses a preparation method of a silicon oxide polishing solution for silicon carbide substrate CMP (chemical mechanical polishing), which comprises the following steps: S1, preparing a solution A and a solution B, respectively storing the solution A and the solution B in independent containers, and maintaining respective stable chemical properties and components in the storage and transportation processes; according to the preparation method of the silicon oxide polishing solution for the CMP of the silicon carbide substrate, the solution A is subjected to fine treatment, silica sol and resin are in full contact in a resin purification device by utilizing polystyrene-divinylbenzene copolymer resin under the conditions of proper temperature and pressure, it is guaranteed that impurities in the treated solution A are greatly reduced, and the quality of the solution A is improved; the multi-step impurity removal process can effectively prevent the impurities from forming scratches and pits on the surface of the silicon carbide substrate, the surface quality of the polished substrate is remarkably improved, and the electrical performance and reliability of a subsequent semiconductor device are guaranteed.

The utility model belongs to car washing technical field, specifically disclose a polishing vertical brush device, include: polishing brush pipe, lining, polishing brush piece and support piece, lining equidistance is connected in the outer wall of polishing brush pipe one round upside, support piece equidistance is connected in the outer wall of polishing brush pipe one round downside, polishing brush piece one end is connected with lining, polishing brush piece and lining between through magic tape connection. Scratchproof car body: adopt 6mm-10mm thick EV piece as bottom support structure, EV piece texture is soft, avoided the scratch of hard material to car body, protected the vehicle appearance. Polishing brush piece and lining are connected through magic tape mode, make the cleaning and replacement operation of brush piece simple and convenient, reduced maintenance cost and time cost. When the brush piece needs to clean or replace, just tear down magic tape easily can complete operation, simple and convenient, improved work efficiency.

The invention relates to the technical field of semiconductor silicon wafer production, in particular to a semiconductor silicon wafer surface polishing machine which is characterized in that front and back symmetrical vertical sliding rods and a supporting cylinder located between the front and back symmetrical vertical sliding rods are fixedly mounted on the upper end face of a base; the upper end face of the base is further provided with a conveying mechanism used for continuously conveying the semiconductor silicon wafers to the polishing space. According to the polishing machine for the surface of the semiconductor silicon wafer, the conveying mechanism, the fixing mechanism and the polishing mechanism are used in cooperation, the surface of the semiconductor silicon wafer is continuously and repeatedly polished through an integrated operation model of feeding, polishing and discharging, and continuous conveying and gradually refined polishing operation are achieved; and each silicon wafer can be processed under the same condition, so that the surface quality and the consistency of the silicon wafers are improved, and the smoothness and the overall surface quality of the silicon wafers are improved.

The invention discloses grinding and polishing equipment for mold production, and relates to the technical field of mold grinding and polishing, the grinding and polishing equipment comprises a base, control pieces are mounted on the left side and the right side of the front end of a mounting plate, each control piece comprises a first vertical plate fixedly mounted on the mounting plate, and a third displacement module is mounted on each first vertical plate; second vertical plates are mounted at the output end of the third displacement module, and a polishing module and a grinding module are mounted on the left second vertical plate and the right second vertical plate correspondingly. A supporting plate is installed at the lower end of the second vertical plate, containing cavities are installed above the supporting plate, and the interiors of the left containing cavity and the right containing cavity are used for storing polishing liquid and grinding liquid correspondingly. According to the grinding and polishing equipment for mold production, before the grinding module is used for grinding or the polishing module is used for polishing, stored grinding liquid and polishing liquid can be stirred, the using effect of the grinding liquid and the polishing liquid is guaranteed, meanwhile, the grinding liquid or the polishing liquid is gradually added in the grinding or polishing process, and the grinding and polishing effect on a mold is improved.

The polishing method comprises the following steps that S1, acid pickling is conducted, specifically, the steel pipe is subjected to acid pickling through an acid pickling solution, and impurities inside and outside the steel pipe are removed; s2, rough polishing is conducted, specifically, the inner face and the outer face of the steel pipe subjected to acid pickling are roughly polished on a polishing machine; s3, fine polishing is conducted, specifically, the steel pipe is put into a polishing solution to be soaked and then taken out, and a curing layer is formed on the surface of the steel pipe through the polishing solution; s4, cleaning: cleaning a cured layer on the surface of the steel pipe to obtain a polished seamless steel pipe; according to the polishing method of the seamless steel pipe, the mode that mechanical polishing and chemical polishing are combined is adopted, the defect that the internal precision of the seamless steel pipe is difficult to control through mechanical polishing can be overcome, the surface of the seamless steel pipe is smooth through mechanical polishing after the seamless steel pipe is pretreated through the pickling solution, and then the seamless steel pipe is finely polished through the polishing solution; and the polishing effect of consistent smoothness of the inner and outer surfaces is achieved.

The utility model belongs to the technical field of steel pipe machining, and particularly relates to a steel pipe surface high-speed polishing device which comprises a panel, two symmetrical shaft seats are fixedly connected to the panel, two wheel shafts are rotationally connected between the two shaft seats, one end of one wheel shaft is in transmission connection with a first motor, and the other end of the other wheel shaft is in transmission connection with a second motor. Three belt wheels are evenly distributed and fixedly connected to each wheel shaft, a rubber belt is connected between every two belt wheels located on the two wheel shafts in a transmission mode, the bottom side of each rubber belt is tightly attached to the panel, a notch is formed in the edge of each rubber belt, a polishing component is arranged in the panel, and a feeding and discharging component is arranged on the panel. According to the polishing device, the surfaces of the steel pipes can be rapidly and evenly polished, the multiple steel pipes can be polished at the same time, the polishing speed is greatly increased, the steel pipe production efficiency is improved, automatic feeding and discharging can be achieved, the machining efficiency is improved, and labor of workers is reduced.

The utility model relates to a device for polishing internal flow channel structures in batches by adopting fluid, which comprises a main input pipeline, a plurality of branch output pipelines connected with the main input pipeline through a flow divider valve, and internal flow channel structures connected with the output ends of the branch output pipelines. The inner sectional area of the branch output pipelines is the same, and the inner sectional area of the main input pipeline is larger than or equal to the sum of the inner sectional areas of the branch output pipelines. A throttle valve is arranged on each branch output pipeline; a flow limiting runner is arranged in the throttling valve, and the inner sectional area of the flow limiting runner is larger than or equal to the inner sectional area of the inner runner structure. According to the inner runner structure, the flow divider valve and the throttling valve are arranged, so that the pressure or flow of the polishing medium entering each inner runner structure is stable, constant and consistent, and the consistent polishing effect is achieved on inner runner structure parts of the same specification.

The present invention belongs to the technical field of aviation equipment maintenance, and specifically refers to a polishing device for aviation equipment maintenance, comprising a base plate, a support column and a top plate, wherein an adaptive force support mechanism is fixedly installed on the base plate, four groups of support columns are arranged and are respectively fixedly installed on the four corners of the base plate, and the top plate is fixedly installed on the support column, and a hydraulic cylinder is fixedly installed on the top plate, and the output end of the hydraulic cylinder penetrates the top plate, and an arc-adjustable polishing mechanism is connected below the output end of the hydraulic cylinder, and the arc-adjustable polishing mechanism comprises a lifting plate, a side plate, a polishing belt assembly, a force-assisted pushing assembly and a two-way driving assembly; multiple groups of polishing belts can move and change the polishing position during polishing, effectively avoiding the problem of polishing dead angles in the gaps between the groups of polishing belts, and at the same time, the polishing belts in opposite directions are rotated for polishing, effectively avoiding displacement caused by the polishing force affecting the quality of the polishing effect.

The present invention relates to the field of semiconductor silicon wafer production technology, specifically to a semiconductor silicon wafer surface polishing machine, wherein the upper end surface of the base is fixedly installed with front-to-back symmetrical vertical slide bars and a support cylinder located between the front-to-back symmetrical vertical slide bars, and the upper end surface of the base is also provided with a transportation mechanism for continuously transporting semiconductor silicon wafers to a polishing space. The semiconductor silicon wafer surface polishing machine, through the coordinated use of the transportation mechanism, the fixing mechanism and the polishing mechanism, adopts an integrated operation model of loading, polishing and unloading to complete continuous multiple polishing of the surface of the semiconductor silicon wafer, realizes continuous transportation and gradually refined polishing operations, ensures that each silicon wafer is processed under the same conditions, thereby improving the surface quality and consistency of the silicon wafer, and improving the smoothness and overall surface quality of the silicon wafer.

The present invention relates to the technical field of quartz wafer processing, and in particular to an edge grinding machine for processing quartz wafers, comprising an external frame, a grinding table, a mounting frame, a main motor and a rotating shaft, wherein the rotating shaft is rotatably connected to the external frame, the main motor provides power to the rotating shaft, the mounting frame is fixed in the external frame, the upper part of the mounting frame is fixed with the grinding table, and the rotating shaft passes through the grinding table. A plurality of quartz wafer substrates are respectively placed in a placement bracket, and then the main motor drives the grinding head in the middle of the grinding table to rotate through the rotating shaft. At the same time, the rotating shaft drives the universal coupling through the first synchronous gear set, and the universal coupling drives the turntable in the placement bracket to rotate, thereby, the grinding head can grind the edge of the rotating quartz wafer substrate.

The utility model belongs to the technical field of iron wire machining, and particularly relates to iron wire outer surface layer polishing equipment which comprises a base, a polishing executing mechanism is arranged above the base, and feeding and discharging mechanisms are arranged on the two sides of the polishing executing mechanism. The iron wire entering the box body is limited and guided through the limiting guide roller arranged on the inner side of the box body, the jack is started to drive the lower table and the lower polishing roller to ascend and descend together, and the lower polishing roller and the upper polishing roller are close to each other through the distance sensor arranged on one side of the lower table, so that the upper and lower outer surfaces of the iron wire are polished; meanwhile, a side polishing assembly is started to polish the side faces of the iron wires, the polished iron wires are subjected to dust removal treatment through cooperation of a cleaning assembly and a cleaning water tank, dust removal is conducted through a dust collection row in the iron wire polishing process, the uniform polishing effect on the upper and lower side faces of the iron wires is guaranteed, and dust pollution generated in the iron wire polishing process is reduced; the cleanliness of the iron wires is improved, and the iron wires are prevented from being scratched by scrap iron.