Printed circuit board and its lamination method with flexible circuit board
A technology of printed circuit boards and flexible circuit boards, which is applied in the directions of printed circuit components, printed circuit assembly of electrical components, and electrical connection of printed components, etc. Slow and other problems, to achieve the effect of solving the blurring of the position
Active Publication Date: 2015-12-16
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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Problems solved by technology
The above process involves the communication and delivery of information from multiple parties, and the response speed is slow and easy to omit
[0004] To sum up, if the FPC board is randomly selected, regardless of the color of the anti-corrosion and anti-oxidant agent for surface treatment, it will likely cause the above-mentioned gold fingers on the FPC board to be pressed together with the gold fingers on the PCB. The shortcomings of blurred alignment, low efficiency and serious misalignment; although this shortcoming can be solved by selecting FPC board materials, the process involves confirming with the FPC board supplier to confirm whether there is an FPC board with a black anti-corrosion and anti-oxidant agent , if there is no need to change the supplier, it is necessary to communicate with multiple parties for confirmation, and sometimes the supplier does not understand our needs, so it is necessary to directly take samples to the supplier for confirmation, which will result in a slower supply response and easy omissions shortcoming
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[0023] The PCB in the prior art includes multi-layer circuit layers. The circuit layers in the prior art have metal areas distributed between the corresponding electrical connection parts (such as gold fingers), which will cause the printed circuit board and the flexible circuit board to be pressed together. The disadvantage of fuzzy alignment between the electrical connection parts (such as golden fingers) on the printed circuit board and the electrical connection parts (such as golden fingers) on the flexible circuit board. Therefore, the printed circuit board according to the specific embodiment of the present invention uses the principle that the metal area of the circuit layer is opaque and the dielectric substrate (dielectric) between the circuit layers is transparent, so that the metal area of the PCB circuit layer is avoided from the circuit layer. Corresponding to the position distribution between the electrical connection parts, that is, there is no metal distribu...
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The invention discloses a printed circuit board comprising a plurality of electric connection parts and at least two circuit layers, wherein metal areas of the circuit layers are distributed beyond the position among the electric connection parts corresponding to the circuit layers. The invention further provides a method for laminating the printed circuit board and a flexible circuit board. When the printed circuit board and the flexible circuit board are laminated, a transmission light and microscope downward-operating method is adopted, i.e. light rays directly irradiate to the flexible circuit board from the printed circuit board, a microscope can be used for clearly distinguishing the electric connection parts, and then, accurate alignment is carried out to perform the laminating operation. Thus, the problem of fuzzy alignment in the prior art is solved.
Description
technical field [0001] The invention relates to a printed circuit board and a pressing method for the printed circuit board and the flexible circuit board. Background technique [0002] The module (Module) process section of the thin film transistor substrate (TFT) usually includes the lamination operation (FOG operation) of the flexible circuit board (flexible printed circuit referred to as FPC board) and glass, and the lamination operation (FOB operation) of the FPC board and PCB (printed circuit board). operate). In the FOG operation, because the glass is transparent, the FOG operation takes the mirror from the bottom, and the transmitted light shines from the glass to the FPC board. Because the glass is transparent and has light transmission, the material of the FPC board (that is, the surface treatment of the FPC board adopts anti-corrosion The color of the antioxidant) has no effect on FOG operation. But for FOB operation, because the PCB design is usually more than ...
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IPC IPC(8): H05K1/02H05K1/11H05K3/36
Inventor 章玲玲
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD