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Radiator structure

A technology for radiators and heat dissipation parts, which is applied in the fields of instrumentation, cooling/ventilation/heating transformation, electrical digital data processing, etc. It can solve the problems of low heat dissipation performance, heavy weight, and high cost, and achieve convenient combination, flexible design, and low cost Effect

Inactive Publication Date: 2011-09-28
神基科技(南昌)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] 1. Low heat dissipation performance;
[0009] 2. The design is not flexible, and it needs to be composed of two parts: cooling fins and cooling base;
[0010] 3. Material selection is inflexible, heavy and costly

Method used

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  • Radiator structure
  • Radiator structure
  • Radiator structure

Examples

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Embodiment Construction

[0027] refer to image 3 , Figure 4 and Figure 5 As shown, they are respectively the overall schematic diagram and the exploded schematic diagram of the radiator structure of the present invention.

[0028] Radiator structure of the present invention, it comprises:

[0029] The heat dissipation fins 21 are provided with an opening 211 in the middle position. In this embodiment, the heat dissipation fins 21 are distributed in a circular shape. The heat dissipation fins 21 are flexible in design, and can be designed according to actual needs in other embodiments. Different shapes, such as: rectangular distribution;

[0030] The first heat dissipation portion 22 is disposed in the opening 211 and completely contacts with each other. The first heat dissipation portion 22 is provided with a groove 221, and the bottom of the groove 221 is in contact with a heat source 20 to conduct heat conduction, and The first heat dissipation part 22 is made of copper;

[0031] The second ...

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PUM

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Abstract

The invention discloses a radiator structure. The radiator structure comprises heat-radiating fins, a first radiating part and a second radiating part, wherein an opening is arranged among the heat-radiating fins, the first heat-radiating part is arranged in the opening and is in matching contact with the opening, the first heat-radiating part is provided with a groove and is made of a copper material, the second heat-radiating part is completely arranged in the groove and is in mutual contact with the groove and is made of an aluminum material. The radiator structure has flexible structure design and low cost, can give attention to the heat-radiating performance and product weight, and is easy to assemble without special processing equipment.

Description

【Technical field】 [0001] The invention relates to a radiator structure, in particular to a radiator structure with quick assembly, light weight and low cost. 【Background technique】 [0002] At present, the main materials of the CPU or North Bridge cooling modules on general-purpose or traditional desktop computers and servers are: aluminum or copper, and the material is relatively simple, which cannot be optimally designed to meet the weight, cost and heat dissipation requirements of the product. Existing radiator structure is as follows: [0003] refer to figure 1 , figure 2 As shown, it is an overall schematic diagram and an exploded schematic diagram of the existing radiator structure. Existing radiator structures include: [0004] The heat dissipation fin 11 has an opening 111 in the middle, and in some embodiments, the heat dissipation fin 11 is made of pure aluminum; [0005] The heat conduction part 12 is completely placed in the opening 111 and is in contact wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H05K7/20
Inventor 尹涛
Owner 神基科技(南昌)有限公司
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