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Radiating device of light-emitting diode (LED)

A technology of light-emitting diodes and heat dissipation devices, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of insufficient heat dissipation speed, poor heat dissipation effect, poor heat transfer effect, etc., to achieve normal operation protection and compact overall structure , the effect of reducing costs

Inactive Publication Date: 2011-09-28
泰州赛龙电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Taking the Taiwan patented cooling device and its electronic device as an example, the design of the heat sink has shortcomings, the heat transfer effect is not good, and the cooling fan is installed directly above the cooling fins, and the cooling fins are in contact with the heating unit below, so as to Heat dissipation
However, due to the distance between the cooling fan and the heating unit, the cooling effect is not good, the cooling speed is not fast enough, and the structure is too large.

Method used

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  • Radiating device of light-emitting diode (LED)
  • Radiating device of light-emitting diode (LED)
  • Radiating device of light-emitting diode (LED)

Examples

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Embodiment 1

[0013] A heat dissipation device for LED light-emitting diodes, including a heat sink 1, fins 2, LED light-emitting chips 3 and a cooling fan 4, the heat sink 1 and the fins 2 are structurally integrated, and one end of the heat sink 1 It is a bowl-shaped structure, and the other end is a cylindrical structure. The fins 2 are arranged on the outer wall of the cylinder of the heat sink 1, and the LED light-emitting chips 3 are arranged at the bottom of the bowl of the heat sink 1. The length of the fin 2 along the wall of the heat sink 1 cylinder is greater than the height of the cylinder, the side of the fin 2 away from the heat sink 1 is a straight line, and the other side has an oblique line, and the oblique line of the fin 2 is An open hollow part 5 is formed on the line side, and the heat dissipation fan 4 is arranged on the end surface of the lower end fin 2 of the cylinder of the heat sink 1, and the fan fins 6 of the heat dissipation fan 4 are arranged in the hollow part...

Embodiment 2

[0015] A heat dissipation device for LED light-emitting diodes, including a heat sink 1, fins 2, LED light-emitting chips 3 and a cooling fan 4, the heat sink 1 and the fins 2 are structurally integrated, and one end of the heat sink 1 It is a bowl-shaped structure, and the other end is a cylindrical structure. The fins 2 are arranged on the outer wall of the cylinder of the heat sink 1, and the LED light-emitting chips 3 are arranged at the bottom of the bowl of the heat sink 1. The length of the fins 2 along the wall of the heat sink 1 cylinder is greater than the height of the cylinder, the side of the fins 2 away from the heat sink 1 is a straight line, and the other side has a curve, and the curved side of the fins 2 An open hollow portion 5 is formed, the heat dissipation fan 4 is arranged on the end surface of the lower fin 2 of the cylinder of the heat sink 1 , and the fan fins 6 of the heat dissipation fan 4 are arranged in the hollow portion.

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Abstract

The invention discloses a radiating device of a light-emitting diode (LED). The device comprises a heat sink, fins, an LED luminous chip and a radiating fan, wherein the heat sink and the fins are structurally combined into a whole; one end of the heat sink has a bowl / cup-shaped structure, and the other end of the heat sink has a cylindrical structure; the fins are arranged on the outer side wall of a cylinder the heat sink; the LED luminous chip is arranged at the bowl / cup-shaped bottom of the heat sink; and the radiating fan is arranged at the lower end of the cylinder of the heat sink. The heat dissipation device can rapidly dissipate heat on the LED, so that the normal work of the LED is effectively protected, the service life of the LED is prolonged, and a high-power LED lamp can be manufactured.

Description

Technical field: [0001] The invention relates to a light-emitting diode (LED) cooling device. Background technique: [0002] Semiconductor lighting technology is one of the most promising high-tech fields in this century and will largely replace traditional light sources. When semiconductor lighting enters the field of practical high-power lighting fixtures, the biggest constraint is conduction and heat dissipation. At present, in order to meet the lighting design requirements of semiconductor lighting lamps, multiple high-power chips must be installed in the lamp body. Sometimes multiple light sources are set in a lamp, and each single light source is packaged by multiple high-power chips. The problem caused by multiple high-power chip structures is that the junction temperature of the LED rises, which affects the luminous rate and life of the LED, and even burns the LED chip. Traditional light-emitting diode (LED) cooling devices mostly use metal heat sinks and fins, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/48
Inventor 吴加杰
Owner 泰州赛龙电子有限公司