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Bonded structural body, bonding method and bonding apparatus

A technology for joining structures and joining methods, which can be used in packaging, welding equipment, laser welding equipment, etc., and can solve problems such as damage and worry of joint components

Inactive Publication Date: 2011-10-05
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that the pressing mechanism may damage the joining member, or a special pressing mechanism is required in order to apply the same pressing force to the joining member.

Method used

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  • Bonded structural body, bonding method and bonding apparatus
  • Bonded structural body, bonding method and bonding apparatus
  • Bonded structural body, bonding method and bonding apparatus

Examples

Experimental program
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Embodiment Construction

[0038] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same component in each drawing, and detailed description is abbreviate|omitted suitably.

[0039] figure 1 It is a schematic diagram illustrating the bonded structure according to the first embodiment of the present invention.

[0040] figure 1 (a) is an exploded schematic view of the bonded structure according to the present embodiment and observed, figure 1 (b) is an assembly schematic diagram showing a state in which the bonded structures according to this embodiment are assembled.

[0041] figure 2 It is a schematic diagram illustrating a joint member according to a modified example of a groove portion.

[0042] figure 2 (a) is a perspective schematic view of the entire joint structure according to this modified example viewed obliquely, figure 2 (b)~ figure 2 (d) is a schematic cross-sectional v...

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PUM

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Abstract

A bonded structural body is provided with a first bonding member and a second bonding member, and at least the first bonding member or the second bonding member has a groove section on a bonding interface between the first bonding member and the second bonding member. In a state where the space in the groove section is depressurized and the first bonding member and the second bonding member are adhered, the first bonding member and the second bonding member are bonded. The bonding members or the bonding member and a light absorbing material can be easily adhered to each other when bonding is performed.

Description

technical field [0001] The present invention relates to a joined structure, a joining method, and a joining device. Specifically, it relates to a joined structure, a joining method, and a joining device in which a plurality of members are brought into close contact with each other and joined. Background technique [0002] As a method of joining a plurality of members, there is a method of using glass frit, lead, or the like. For example, light-emitting panels such as PDP (Plasma Display Panel), SED (Surface-conduction Electron-emitter Display), FED (Field Emission Display), and Organic Electroluminescence Display (Organic Electroluminescence Display) may have a structure in which two sheets of glass pass through frame to join. The above-mentioned methods are often used for their joining. [0003] In addition, as a method of joining a plurality of members, there is a joining method using laser irradiation. This joining method is a method of joining by absorbing the energy ...

Claims

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Application Information

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IPC IPC(8): B23K26/20B23K26/02B23K26/18B23K26/42B23K26/12B23K26/32C03C27/06
CPCB23K26/18B23K26/246H01J9/26C03B23/245C03C27/06B23K26/02B23K26/244B23K26/127B23K26/206B23K26/24B65D81/2038B23K26/1224B23K26/211B23K26/702
Inventor 铃木端生矶明典藤森康朝
Owner SHIBAURA MECHATRONICS CORP