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Shell of electronic device and manufacturing method of shell

A technology of electronic devices and manufacturing methods, applied in the direction of electrical equipment casings/cabinets/drawers, electrical components, and other household appliances, which can solve the problems of increased printing and drying time and labor costs, affecting product competitiveness, shadow traces, etc. problems, to save time and labor costs, improve the overall aesthetics, and avoid the effect of ink flushing

Inactive Publication Date: 2011-10-19
ASUSTEK COMPUTER INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the process of forming the decorative layer 3 by multiple printings will lead to a significant increase in the printing and drying time and labor costs of the entire plastic injection molding, thus seriously affecting the competitiveness of the product in the market
[0008] In addition, when the plastic is injection molded, if the mold 2 is removed first, the position K corresponding to the injection port 20 on the plastic injection molded product (such as Figure 1D shown) will produce shadow traces; if the mold 2 is removed after the plastic injection molding, the position K corresponding to the injection port 20 on the plastic injection molded product will produce a protrusion, even if the protrusion is finally cut off , there may still be a small piece of unevenness at position K

Method used

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  • Shell of electronic device and manufacturing method of shell
  • Shell of electronic device and manufacturing method of shell
  • Shell of electronic device and manufacturing method of shell

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Experimental program
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no. 1 Embodiment

[0019] A first embodiment of the present invention is a method for manufacturing an electronic device casing. In one embodiment of the present invention, the manufacturing method of the casing of the electronic device is an in-mold film (IMF) injection molding method, but not limited thereto.

[0020] Please refer to figure 2 , figure 2 Shown is a flow chart of an embodiment of the manufacturing method of the electronic device casing of the present invention. Such as figure 2 As shown, the manufacturing method of the electronic device casing in this embodiment includes the following steps: First, the method executes step S10, providing a film with an anti-wash sheet in a mold. In practical applications, the film with the anti-flushing ink sheet can be obtained by pasting the anti-flushing ink sheet on the film. As for the scope and size of the area where the anti-wash ink sheet is pasted on the film, there is no certain limit, depending on actual needs.

[0021] Genera...

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PUM

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Abstract

The invention discloses a shell of an electronic device and a manufacturing method of the shell. A film provided with a washout protection sheet is arranged in die. A plastic is injected into the die from an injection port to form the shell, and the washout protection sheet corresponds to the injection port. After the shell is formed, the washout protection sheet is integrated with the plastic.

Description

technical field [0001] The present invention relates to an electronic device casing and a manufacturing method thereof, in particular to an electronic device casing using an anti-wash ink sheet and a manufacturing method thereof. Background technique [0002] With the continuous evolution of science and technology, all kinds of consumer electronic information products are becoming more and more popular. Due to the increasing demand of consumers for the appearance of consumer electronic information products, the traditional plastic surface processing technology is bound to be unable to satisfy consumers. demand. [0003] For example, because the traditional plastic injection process requires injection molding first, and then the post-processing procedure on the surface of the finished product, in addition to being difficult to achieve three-dimensional multi-color printing, when different parts of the finished product have different color combinations, the traditional The ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/14H05K5/00B29K677/00B29K633/04B29K627/00
CPCB29C45/14688B29C45/14836B29C2045/0027B29C2045/14844B29K2995/002B29L2031/3481
Inventor 蔡升佑
Owner ASUSTEK COMPUTER INC
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