Manufacturing method of array substrate

A technology for array substrates and manufacturing methods, which is applied in the field of manufacturing array substrates with electrostatic protection, can solve problems such as devices not being protected, and achieve the effect of avoiding damage

Active Publication Date: 2011-11-16
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The electrostatic discharge protection electrode 106 and the short circuit 105 formed after the etching of the second layer of metal by the above method provide electrostatic discharge protection for the substrate and the devices on the substrate in the subsequent manufacturing process, but the second layer of metal and its previous The substrate and the devices on the substrate are not protected during the manufacturing process

Method used

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  • Manufacturing method of array substrate
  • Manufacturing method of array substrate
  • Manufacturing method of array substrate

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Embodiment Construction

[0064] In the production process of the array substrate of the X-ray detector, in order to ensure that the array substrate and the thin film transistors and photodiodes formed on the array substrate are not damaged by electrostatic discharge, and at the same time do not increase the process steps, the present invention provides a A method for manufacturing an array substrate with electrostatic protection, the method starts to protect the substrate and the devices on the subsequently formed substrate in the first process of manufacturing the array substrate of the X-ray detector, so as to avoid the accumulation of static charges during the production process, The methods include:

[0065] providing a substrate on which to deposit a first metal layer;

[0066] Etching the first metal layer to form a first metal interconnection line, a first short-circuit line, and a first electrostatic discharge protection electrode, the first short-circuit line connecting the first metal interc...

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Abstract

The invention relates to a manufacturing method of an array substrate. The manufacturing method comprises the following steps: providing a substrate, depositing and etching a first metal layer on the substrate, forming a first metal interconnection line, a first short-circuit line and a first electrostatic discharge protective electrode; forming and etching an insulating layer respectively above the first metal interconnection line, the first short-circuit line and the first electrostatic discharge protective electrode, respectively forming via holes on the insulating layers above the first metal interconnection line, the first short-circuit line and the first electrostatic discharge protective electrode; depositing and etching second metal layers on the insulating layers, and forming a second metal interconnection line which is electrically connected with the first metal interconnection line through a corresponding via hole, a second short-circuit line and a second electrostatic discharge protective electrode electrically connected with the first electrostatic discharge protective electrode through a corresponding via hole, wherein the second short-circuit line connects the second metal interconnection line and the second electrostatic discharge protective electrode; etching and for disconnecting the first short-circuit line. In the method, the electrostatic discharge protection on an X-ray detector is started from the first process without increasing processing steps.

Description

technical field [0001] The invention relates to a method for manufacturing an array substrate, in particular to a method for manufacturing an array substrate with electrostatic protection. Background technique [0002] The development of modern medicine has completely changed people's lives. Many diseases can be known at an early stage to win the best treatment time, and organ lesions can be clearly seen. This is inseparable from medical imaging technology such as X-ray transmission technology. With the development of science and technology, X-ray transmission technology has been digitized, and the most concerned testing instrument in digital X-ray technology is the X-ray detector. [0003] Please refer to figure 1 , figure 1 It is a schematic diagram of an array substrate circuit structure of an existing X-ray detector. The array substrate includes a glass substrate (not shown), and the glass substrate includes a display area 101 , and areas other than the display area 1...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/144H01L21/768
Inventor 金利波邱承彬夏军李懿馨凌严于祥国
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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