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Socket connector assembly with conductive posts

A socket connector, conductive column technology, applied in the direction of connection, fixed connection, contact parts, etc., can solve problems such as electroplating materials that are not allowed to conduct electricity

Inactive Publication Date: 2011-11-23
TE CONNECTIVITY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, a hole that is too narrow across the thickness of the substrate will not allow conductive plating material to coat or plate the hole walls along the entire thickness of the substrate

Method used

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  • Socket connector assembly with conductive posts
  • Socket connector assembly with conductive posts
  • Socket connector assembly with conductive posts

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] figure 1 is an exploded view of an electronic system 100 including a receptacle connector assembly 102 formed in accordance with one embodiment of the present invention. The receptacle connector assembly 102 is mounted on a circuit board 104 . The mating electronics package 106 is loaded on the receptacle connector assembly 102 to electrically couple the electronics package 106 and the receptacle connector assembly 102 . When loaded onto receptacle connector 102 , electronic package 106 is electrically connected to circuit board 104 through receptacle connector assembly 102 . The electronic package 106 may be a chip or a module, such as, without limitation, a central processing unit (CPU), a microprocessor, or an application specific integrated circuit (ASIC), among others.

[0017] Receptacle connector assembly 102 includes a dielectric housing 108 mounted to circuit board 104 . The housing 108 holds a socket substrate 110 formed in accordance with one embodiment of...

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PUM

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Abstract

A socket connector assembly includes a socket substrate (110), terminals, and conductive posts. The socket substrate (110) has a mating side (402) and an opposite mounting side (404) with holes (420) extending through the socket substrate. The terminals (112) are disposed above the mating side of the socket substrate and are configured to engage conductive pads of a mating substrate (114) of an electronic package (106). The conductive posts are disposed in the holes and are elongated between upper and lower ends (504, 506). The upper ends are electrically coupled with the terminals and the lower ends are configured to be electrically joined with a circuit board (104). The posts includes a radially protruded rib (514) and electrically couple the electronic package with the circuit board by providing conductive pathways through the socket substrate between the mating side and the mounting side of the socket substrate.

Description

technical field [0001] The present invention relates to a socket connector assembly for interconnecting an electronic package and a circuit board. Background technique [0002] The trend towards smaller, lighter, higher performance electronic components and higher density of circuit boards has led to the development of surface mount technology in the design of printed circuit boards and electronic packages. Surface mountable packages allow packaged structures such as computer processors to be attached independently to pads on the surface of a circuit board rather than via contacts or pins soldered in plated holes through the circuit board. Surface mount technology allows higher component density on the board, saving board space. [0003] One form of surface mount technology includes socket connectors. The receptacle connector may include a substrate having conductive terminals on one side of the connector and an array of conductive solder elements on the opposite side. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/02H01R13/20H01R13/40H01R13/46H01R12/55H01R33/74
CPCH05K7/1061H01R12/52
Inventor 艾伦·R·麦克杜格尔
Owner TE CONNECTIVITY CORP